SCOPUS 정보 검색 플랫폼

Journal of Electronic Materials

Volumn 38, Issue 12, 2009, Pages 2563-2572

The influence of current direction on the Cu-Ni cross-interaction in Cu/Sn/Ni diffusion couples

(4) Wu, W H a Chung, H L a Chen, C N a Ho, C E a

a YUAN ZE UNIVERSITY (Taiwan)

Author keywords

Cu Ni cross interaction; Cu Sn Ni; Current direction; Electromigration

Indexed keywords

CU-NI CROSS-INTERACTION; CURRENT DIRECTION; CURRENT-STRESSING; DIFFUSION COUPLE; DOMINANT REACTION PRODUCT; ELECTRON FLOW; JOINT CONFIGURATION; TERNARY COMPOUNDS;

ELECTRIC CURRENTS; ELECTROMIGRATION; TIN;

NICKEL;

EID: 72549107539 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-009-0876-2 Document Type: Article

Times cited : (38)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.