Kinetic analysis of the interfacial reactions in Ni/Sn/Cu sandwich structures

Journal of Electronic Materials

Volumn 35, Issue 11, 2006, Pages 1955-1960

  Wang, S J ^a   Liu, C Y ^a  

^a NATIONAL CENTRAL UNIVERSITY   (Taiwan)

Author keywords

Flip chip; Packaging; Pb free solder

Indexed keywords

DISSOLUTION FLUX; INTERFACIAL REACTION; PB-FREE SOLDER;

DISSOLUTION; GROWTH KINETICS; NICKEL COMPOUNDS; TERNARY SYSTEMS; TIN COMPOUNDS;

REACTION KINETICS;

EID: 33845752967     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-006-0299-2     Document Type: Conference Paper

References (16)

1. L.F. Miller, Proc. IEEE Electronic Components Conf. (Piscataway, NJ: IEEE, 1968), pp. 52-55.
2. V.C. Marcotte and N.G. Koopman, Proc. 31st IEEE Electronic Components Conf. (Piscataway, NJ: IEEE, 1981), p. 157.
3. S.J. Wang and C.Y. Liu, J. Electron. Mater. 32, 1303 (2003).
4. S.W. Chen, S.H, Wu, and S.W. Lee, J. Electron. Mater. 32, 1188 (2003).
5. C.M. Tsai, W.C. Luo, C.W. Chang, Y.C. Shieh, and C.R. Kao, J. Electron. Mater. 33, 1424 (2004).
6. K. Zeng and K.N. Tu, Mater. Sci. Eng., R 38, 55 (2002).
7. S.K. Kang, W.K. Choi, D.Y. Shih, P. Lauro, D.W. Henderson, T. Gosselin, and D.N. Leonard, Proc. 52nd Electronic Components and Technology Conf. (Piscataway NJ: IEEE, 2002), pp. 146-150.
8. C.E. Ho, R.Y. Tsai, Y.L. Lin, and C.R. Kao, J. Electron. Mater. 31, 548 (2002).
9. S.J. Wang, H.J. Kao, and C.Y. Liu, J. Electron. Mater. 33, 1130 (2004).
10. W.T. Chen, C.E. Ho, and C.R. Kao, J. Mater. Res. 17, 263 (2002).
11. S.J. Wang and C.Y. Liu, Scripta Mater. 49, 813 (2003).
12. S.K. Kang, D.Y. Shih, D. Leonard, D.W. Henderson, T. Gosselin, S. Cho, J. Yu, and W.K. Choi, J. Mater. 56, 34 (2004).
13. K. Zeng and K.N. Tu, Mater. Sci. Eng., R 38, 55 (2002).
14. K.N. Tu and K. Zeng, Mater. Sci. Eng., R 34, 1 (2001).
15. M. Onishi and H. Fujibuchi, Trans. JIM, 16, 539 (1975).
16. V.E. Starke, Z. Metallkd. 55, 107 (1964).