Effect of cross-interaction between Ni and Cu on growth kinetics of intermetallic compounds in Ni/Sn/Cu diffusion couples during aging

Journal of Electronic Materials

Volumn 37, Issue 1, 2008, Pages 61-72

  Hong, K K ^a   Ryu, J B ^a,b   Park, C Y ^b   Huh, J Y ^a  

^a Korea University   (South Korea)

^b SAMSUNG Electronics   (South Korea)

Author keywords

Ball grid array solder joint; Growth kinetics; Ni Sn Cu diffusion couple; Solid state cross interaction; Ternary intermetallic compound

Indexed keywords

BALL GRID ARRAY (BGA); BALL-GRID-ARRAY SOLDER JOINTS; SOLID-STATE CROSS-INTERACTION; TERNARY INTERMETALLIC COMPOUNDS;

AGING OF MATERIALS; DIFFUSION; GROWTH RATE; MOLECULAR INTERACTIONS; NICKEL ALLOYS;

INTERMETALLICS;

EID: 37249009180     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-007-0283-5     Document Type: Article

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