The solid solubility of Ag and Cu in the Sn phase of eutectic and near-eutectic Sn-Ag-Cu solder alloys

Journal of Electronic Materials

Volumn 33, Issue 11, 2004, Pages 1313-1315

  Snugovsky, L ^a   Cermignani, C ^a   Perovic, D D ^a   Rutter, J W ^a  

^a UNIVERSITY OF TORONTO   (Canada)

Author keywords

Pb free solder; Sn Ag Cu solder; Solid solubility

Indexed keywords

BINARY ALLOYS; COMPOSITION; COOLING; COPPER ALLOYS; EUTECTICS; PHASE DIAGRAMS; PHASE EQUILIBRIA; SILVER ALLOYS; SOLID SOLUTIONS; SOLUBILITY; TERNARY SYSTEMS; TIN ALLOYS;

BALL-GRID ARRAY BALLS; COOLING RATE; SOLID SOLUBILITY;

SOLDERING ALLOYS;

EID: 10044249959     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-004-0159-x     Document Type: Conference Paper

References (14)

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