Electric current effects upon the Sn\Cu and Sn\Ni interfacial reactions

Journal of Electronic Materials

Volumn 27, Issue 11, 1998, Pages 1193-1199

  Chen, Sinn Wen ^a   Chen, Chih Ming ^a   Liu, Wen Chyuarn ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

Electric current effect; Electromigration; Interfacial reaction; Intermetallic

Indexed keywords

ELECTRIC CURRENTS; ELECTROMIGRATION; INTERMETALLICS; TIN ALLOYS;

INTERFACIAL REACTIONS;

SOLDERING ALLOYS;

EID: 0032209640     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-998-0068-5     Document Type: Article

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