Cross-interaction between Ni and Cu across Sn layers with different thickness

Journal of Electronic Materials

Volumn 36, Issue 11, 2007, Pages 1455-1461

  Chang, Chien Wei ^a   Yang, Su Chun ^b   Tu, Chun Te ^c   Kao, C Robert ^b  

^a NATIONAL CENTRAL UNIVERSITY   (Taiwan)

^b NATIONAL TAIWAN UNIVERSITY   (Taiwan)

^c Henkel Accurus Scientific Co Ltd   (Taiwan)

Author keywords

Interfacial reaction; Lead free solder; Ni Sn Cu

Indexed keywords

COPPER; DIFFUSION; ELECTRONICS PACKAGING; ELECTROPLATING; NICKEL; SURFACE CHEMISTRY;

CROSS INTERACTION; DIFFUSION COUPLES; LEAD FREE SOLDERS;

SOLDERING ALLOYS;

EID: 35248839558     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-007-0235-0     Document Type: Conference Paper

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