Effects of electromigration on interfacial reactions in cast Sn/Cu joints

Journal of Materials Research

Volumn 22, Issue 3, 2007, Pages 695-702

  Chen, Sinn Wen ^a   Wang, Chao Hong ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; CURRENT DENSITY; ELECTRIC CURRENTS; ELECTROMIGRATION; GRAIN BOUNDARIES; TIN;

ELECTRONS FLOW;

INTERFACES (MATERIALS);

EID: 33947211184     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/jmr.2007.0093     Document Type: Article

References (18)

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