Interaction of intermetallic compound formation in Cu/SnAgCu/NiAu sandwich solder joints

Journal of Electronic Materials

Volumn 35, Issue 5, 2006, Pages 897-904

  Xia, Yanghua ^a   Lu, Chuanyan ^b   Chang, Junling ^a   Xie, Xiaoming ^a,b  

^a SHANGHAI INSTITUTE OF MICROSYSTEM AND INFORMATION TECHNOLOGY   (China)

^b DaimlerChrysler SIM Technology Co Ltd   (China)

Author keywords

Coupling effect; Intermetallic compounds; SnAgCu solder

Indexed keywords

COUPLING EFFECTS; IMC FORMATION; PHASE STRUCTURES; SNAGCU SOLDERS;

COPPER; ENERGY DISPERSIVE SPECTROSCOPY; INTERFACES (MATERIALS); SCANNING ELECTRON MICROSCOPY; SEMICONDUCTING INTERMETALLICS; TIN COMPOUNDS; X RAY DIFFRACTION;

SOLDERED JOINTS;

EID: 33745032580     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/BF02692545     Document Type: Conference Paper

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