Effect of Cu content on the mechanical reliability of Ni/Sn-3.5Ag system

Journal of Materials Research

Volumn 22, Issue 3, 2007, Pages 770-776

  Kim, J Y ^a   Sohn, Y C ^a,b   Yu, Jin ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^b Samsung Advanced Institute of Technology (SAIT)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

BALL SHEAR TEST; MECHANICAL RELIABILITY; SOLDER JOINT MICROSTRUCTURES; UNDER-BUMP METALLIZATION;

COPPER; ELECTROPLATING; METALLIZING; METALLOGRAPHIC MICROSTRUCTURE; SOLDERED JOINTS;

NICKEL ALLOYS;

EID: 33947248427     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/jmr.2007.0085     Document Type: Article

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