Silicon microcontact printing engines

Journal of Micromechanics and Microengineering

Volumn 19, Issue 2, 2009, Pages

  Syms, R R A ^a   Zou, H ^b   Choonee, K ^a   Lawes, R A ^a  

^a IMPERIAL COLLEGE LONDON   (United Kingdom)

^b DALIAN UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ALIGNMENT; ELECTRON BEAM LITHOGRAPHY; ELECTRON DEVICE MANUFACTURE; ELECTROSTATIC ACTUATORS; ELECTROSTATICS; MEMS; MICROELECTROMECHANICAL DEVICES; PHOTORESISTS; PRINTING; REACTIVE ION ETCHING; SEMICONDUCTING SILICON COMPOUNDS; SILICON ON INSULATOR TECHNOLOGY; SILICONES; WAFER BONDING;

ALIGNMENT STRUCTURES; BULK SILICONS; DEEP REACTIVE ION ETCHINGS; ELECTROSTATIC ACTUATIONS; ETCHED SUBSTRATES; ETCHED SURFACES; GOLD-COATED SURFACES; HEXADECANETHIOL; INK TRANSFERS; MECHANICAL PARTS; MICRO-CONTACT PRINTINGS; MICROELECTROMECHANICAL-SYSTEMS TECHNOLOGIES; MINIMUM FEATURE SIZES; PRINT ENGINES; PRINT HEADS; SELF-ALIGNED; SILICON-ON-INSULATOR WAFERS; SOFT STAMPS; SPRAY COATINGS; WAFER-SCALE;

SILICON WAFERS;

EID: 61849184997     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/19/2/025027     Document Type: Article

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