Versatile patterning process for semiconductors based on microcontact printing

Electronics Letters

Volumn 35, Issue 20, 1999, Pages 1731-1733

  Schmidt, G ^a   Tormen, M ^a   Muller G ^a   Molenkamp, L W ^a   Chen, Y ^b   Lebib, A ^b   Launois, H ^b  

^a UNIVERSITY OF WÜRZBURG   (Germany)

^b CNRS   (France)

Author keywords

[No Author keywords available]

Indexed keywords

CHROMIUM; DRY ETCHING; ELECTRON BEAM LITHOGRAPHY; EVAPORATION; GOLD; MONOLAYERS; POLYMETHYL METHACRYLATES; PRINTING; REACTIVE ION ETCHING; SILICON WAFERS; SUBSTRATES;

LIFT OFF; MICROCONTACT PRINTING; SELF ASSEMBLED MONOLAYERS; WET ETCHING;

SEMICONDUCTOR DEVICE MANUFACTURE;

EID: 0033195438     PISSN: 00135194     EISSN: None     Source Type: Journal    
DOI: 10.1049/el:19991072     Document Type: Article

References (7)

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