Stress and microstructure evolution in thick sputtered films

Acta Materialia

Volumn 57, Issue 7, 2009, Pages 2055-2065

  Detor, Andrew J ^a   Hodge, Andrea M ^b   Chason, Eric ^c   Wang, Yinmin ^a   Xu, Hongwei ^d   Conyers, Mark ^d   Nikroo, Abbas ^d   Hamza, Alex ^a  

^a LAWRENCE LIVERMORE NATIONAL LABORATORY   (United States)

^b Department of Aerospace and Mechanical Engineering ^*  (United States)

^c Brown University   (United States)

^d GENERAL ATOMICS   (United States)

Author keywords

Nanocrystalline microstructure; Physical vapor deposition (PVD); Residual stresses; Texture; Thick films

Indexed keywords

BERYLLIUM; GRAIN GROWTH; NANOCRYSTALLINE MATERIALS; PHYSICAL VAPOR DEPOSITION; RESIDUAL STRESSES; SPUTTER DEPOSITION; STRENGTH OF MATERIALS; SURFACE STRUCTURE; TEXTURES; THICK FILMS; VAPORS;

ACTIVE AREAS; DEPOSITION TECHNIQUES; EXPERIMENTAL MEASUREMENTS; GRAIN STRUCTURES; GROWTH TEXTURES; IN-SITU; MATERIAL PARAMETERS; MICRO-STRUCTURAL CHARACTERIZATIONS; MICROSTRUCTURE EVOLUTIONS; NANOCRYSTALLINE MICROSTRUCTURE; RESIDUAL STRESS MEASUREMENTS; SPUTTERED FILMS; SPUTTERING GAS PRESSURES; STRESS GENERATIONS; STRESS LEVELS; STRESS STATE; SUB MICRONS; SUBSTRATE BIASING; THEORETICAL MODELS;

FILM GROWTH;

EID: 61849166740     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2008.12.042     Document Type: Article

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