Residual stress control in MoCr thin films deposited by ionized magnetron sputtering

Surface and Coatings Technology

Volumn 200, Issue 22-23 SPEC. ISS., 2006, Pages 6549-6553

  Tranchant, J ^a   Angleraud, B ^a   Tessier, P Y ^a   Besland, M P ^a   Landesman, J P ^a   Djouadi, M A ^a  

^a INSTITUT DES MATÉRIAUX JEAN ROUXEL   (France)

Author keywords

IPVD; Magnetron sputtering; MoCr; Plasma diagnostic; Stress; Thin films

Indexed keywords

COMPOSITION; COMPRESSIVE STRESS; IONIZATION; MAGNETRON SPUTTERING; PLASMA DIAGNOSTICS; RESIDUAL STRESSES; TENSILE STRESS; THIN FILMS;

DISCHARGE GAS PRESSURE; IONIZED MAGNETRON SPUTTERING; OPTICAL EMISSION SPECTROSCOPY; RADIO-FREQUENCY ANTENNA;

MOLYBDENUM COMPOUNDS;

COMPOSITION; COMPRESSIVE STRESS; IONIZATION; MAGNETRON SPUTTERING; MOLYBDENUM COMPOUNDS; PLASMA DIAGNOSTICS; RESIDUAL STRESSES; TENSILE STRESS; THIN FILMS;

EID: 33646125615     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2005.11.104     Document Type: Article

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