Competition between tensile and compressive stress mechanisms during Volmer-Weber growth of aluminum nitride films

Journal of Applied Physics

Volumn 98, Issue 4, 2005, Pages

  Sheldon, Brian W ^a   Rajamani, Ashok ^a   Bhandari, Abhinav ^a   Chason, Eric ^a   Hong, S K ^a   Beresford, R ^a  

^a BROWN UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

GROWTH RATE; GROWTH TEMPERATURE; LARGE STRESS VARIATIONS; STRESS MECHANISMS;

ALUMINUM NITRIDE; COMPRESSIVE STRESS; GRAIN BOUNDARIES; MOLECULAR BEAM EPITAXY; TENSILE STRENGTH;

METALLIC FILMS;

EID: 25144487650     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1994944     Document Type: Article

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