-
1
-
-
0025538906
-
Measurements of the intrinsic stress in thin metal films
-
Aberman R. Measurements of the intrinsic stress in thin metal films. Vacuum. 41:1990;1279-1282.
-
(1990)
Vacuum
, vol.41
, pp. 1279-1282
-
-
Aberman, R.1
-
2
-
-
0005910628
-
In situ measurement of stresses in thin films
-
Aberman R. In situ measurement of stresses in thin films. Mater Res. Soc. Symp. Proc. 239:1992;25-36.
-
(1992)
Mater Res. Soc. Symp. Proc.
, vol.239
, pp. 25-36
-
-
Aberman, R.1
-
3
-
-
0022091830
-
The internal stress in thin silver, copper and gold films
-
Aberman R., Koch R. The internal stress in thin silver, copper and gold films. Thin Solid Films. 129:1985;71-78.
-
(1985)
Thin Solid Films
, vol.129
, pp. 71-78
-
-
Aberman, R.1
Koch, R.2
-
5
-
-
0034333905
-
Surface stress model for intrinsic stresses in thin films
-
Cammarata R.C., Trimble T.M., Srolovitz D.J. Surface stress model for intrinsic stresses in thin films. J. Mater. Res. 15:2000;2468-2474.
-
(2000)
J. Mater. Res.
, vol.15
, pp. 2468-2474
-
-
Cammarata, R.C.1
Trimble, T.M.2
Srolovitz, D.J.3
-
6
-
-
0037091142
-
Origin of compressive residual stress in polycrystalline thin films
-
156103
-
Chason, E., Sheldon, B.W., Freund, L.B., Floro, J.A., Hearne, S.J., 2002. Origin of compressive residual stress in polycrystalline thin films. Phys. Rev. Lett. 88, 156103:1-4.
-
(2002)
Phys. Rev. Lett.
, vol.88
, pp. 1-4
-
-
Chason, E.1
Sheldon, B.W.2
Freund, L.B.3
Floro, J.A.4
Hearne, S.J.5
-
8
-
-
0015728434
-
The shape of intergranular creep cracks growing by surface diffusion
-
Chuang T.-J., Rice J.R. The shape of intergranular creep cracks growing by surface diffusion. Acta Metall. 21:1973;1625-1628.
-
(1973)
Acta Metall.
, vol.21
, pp. 1625-1628
-
-
Chuang, T.-J.1
Rice, J.R.2
-
10
-
-
0035340248
-
The dynamic competition between stress generation and relaxation mechanisms during coalescence of Volmer-Weber thin films
-
Floro J.A., Hearne S.J., Hunter J.A., Kotula P., Chason E., Seel S.C., Thompson C.V. The dynamic competition between stress generation and relaxation mechanisms during coalescence of Volmer-Weber thin films. J. Appl. Phys. 89:2001;4886-4897.
-
(2001)
J. Appl. Phys.
, vol.89
, pp. 4886-4897
-
-
Floro, J.A.1
Hearne, S.J.2
Hunter, J.A.3
Kotula, P.4
Chason, E.5
Seel, S.C.6
Thompson, C.V.7
-
12
-
-
0035339708
-
Model for stress generated upon contact of neighboring islands on the surface of a substrate
-
Freund L.B., Chason E. Model for stress generated upon contact of neighboring islands on the surface of a substrate. J. Appl. Phys. 89:2001;4866-4873.
-
(2001)
J. Appl. Phys.
, vol.89
, pp. 4866-4873
-
-
Freund, L.B.1
Chason, E.2
-
14
-
-
0037120411
-
Reversible stress relaxation during precoalescence interruptions of Volmer-Weber thin film growth
-
126103
-
Friesen, C., Thompson, C.V., 2002. Reversible stress relaxation during precoalescence interruptions of Volmer-Weber thin film growth. Phys. Rev. Lett. 89, 126103:1-4.
-
(2002)
Phys. Rev. Lett.
, vol.89
, pp. 1-4
-
-
Friesen, C.1
Thompson, C.V.2
-
15
-
-
0032684355
-
Crack-like grain-boundary diffusion wedges in thin metal films
-
Gao H., Zhang L., Nix W.D., Thompson C.V., Arzt E. Crack-like grain-boundary diffusion wedges in thin metal films. Acta Mater. 47:1999;2865-2878.
-
(1999)
Acta Mater.
, vol.47
, pp. 2865-2878
-
-
Gao, H.1
Zhang, L.2
Nix, W.D.3
Thompson, C.V.4
Arzt, E.5
-
16
-
-
0001536019
-
Stresses in thin films: The relevance of grain boundaries and impurities
-
Hoffman R.W. Stresses in thin films. the relevance of grain boundaries and impurities Thin Solid Films. 34:1976;185-190.
-
(1976)
Thin Solid Films
, vol.34
, pp. 185-190
-
-
Hoffman, R.W.1
-
17
-
-
36849135234
-
Lattice and grain boundary self-diffusion in silver
-
Hoffman R.E., Turnbull D. Lattice and grain boundary self-diffusion in silver. J. Appl. Phys. 22:1951;634-639.
-
(1951)
J. Appl. Phys.
, vol.22
, pp. 634-639
-
-
Hoffman, R.E.1
Turnbull, D.2
-
18
-
-
0032660979
-
Crystallite coalescence: A mechanism for intrinsic tensile stresses in thin films
-
Nix W.D., Clemens B.M. Crystallite coalescence. a mechanism for intrinsic tensile stresses in thin films J. Mater. Res. 14:1999;3467-3473.
-
(1999)
J. Mater. Res.
, vol.14
, pp. 3467-3473
-
-
Nix, W.D.1
Clemens, B.M.2
-
19
-
-
79956013395
-
Intrinsic tensile stress and grain boundary formation during Volmer-Weber film growth
-
Rajamani A., Sheldon B.W., Chason E., Bower A.F. Intrinsic tensile stress and grain boundary formation during Volmer-Weber film growth. Appl. Phys. Lett. 81:2002;1204-1206.
-
(2002)
Appl. Phys. Lett.
, vol.81
, pp. 1204-1206
-
-
Rajamani, A.1
Sheldon, B.W.2
Chason, E.3
Bower, A.F.4
-
20
-
-
0344960194
-
-
Ph.D. Thesis, Stanford University
-
Ramaswamy, V., 2001. Ph.D. Thesis, Stanford University.
-
(2001)
-
-
Ramaswamy, V.1
-
21
-
-
0000550211
-
Tensile stress evolution during deposition of Volmer-Weber thin films
-
Seel S.C., Thompson C.V., Hearne S.J., Floro J.A. Tensile stress evolution during deposition of Volmer-Weber thin films. J. Appl. Phys. 88:2000;7079-7088.
-
(2000)
J. Appl. Phys.
, vol.88
, pp. 7079-7088
-
-
Seel, S.C.1
Thompson, C.V.2
Hearne, S.J.3
Floro, J.A.4
-
22
-
-
0035890387
-
Intrinsic stress, island coalescence and surface roughness during the growth of polycrystalline films
-
Sheldon B.W., Lau K.H.A., Rajamani A. Intrinsic stress, island coalescence and surface roughness during the growth of polycrystalline films. J. Appl. Phys. 90:2001;5097-5103.
-
(2001)
J. Appl. Phys.
, vol.90
, pp. 5097-5103
-
-
Sheldon, B.W.1
Lau, K.H.A.2
Rajamani, A.3
-
23
-
-
0042768567
-
Intrinsic compressive stress in polycrystalline films with negligible grain boundary diffusion
-
Sheldon B.W., Ditkowski A., Beresford R., Chason E., Rankin J. Intrinsic compressive stress in polycrystalline films with negligible grain boundary diffusion. J. Appl. Phys. 94:2003;948-957.
-
(2003)
J. Appl. Phys.
, vol.94
, pp. 948-957
-
-
Sheldon, B.W.1
Ditkowski, A.2
Beresford, R.3
Chason, E.4
Rankin, J.5
-
24
-
-
0001132577
-
Measurements of stress during vapor deposition of copper and silver thin films and multilayers
-
Shull A.L., Spaepen F. Measurements of stress during vapor deposition of copper and silver thin films and multilayers. J. Appl. Phys. 80:1996;6243-6256.
-
(1996)
J. Appl. Phys.
, vol.80
, pp. 6243-6256
-
-
Shull, A.L.1
Spaepen, F.2
-
26
-
-
0026899706
-
II - Mean curvature and weighted mean curvature
-
Taylor J.E. II - Mean curvature and weighted mean curvature. Acta Metall. Mater. 40:1992;1475-1485.
-
(1992)
Acta Metall. Mater.
, vol.40
, pp. 1475-1485
-
-
Taylor, J.E.1
|