Assembly, characterization, and reworkability of Pb-free ultra-fine pitch C4s for system-on-package

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2007, Pages 42-48

  Dang, B ^a   Wright, S L ^a   Andry, P S ^a   Tsang, C K ^a   Patel, C ^a   Polastre, R ^a   Horton, R ^a   Sakuma, K ^a   Webb, B C ^a   Sprogis, E ^b   Zhang, G ^c   Sharma, A ^a   Knickerbocker, J U ^a  

^a IBM T J WATSON RESEARCH CENTER   (United States)

^b IBM   (United States)

^c UNIVERSITY OF ILLINOIS AT URBANA CHAMPAIGN   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

KNOW-GOOD-DIE (KGD); KNOWN-GOOD-MODULES (KGM); MULTI-CHIP MODULE; TEMPORARY CHIP ATTACHMENT (TCA);

ASSEMBLY; CONTACT RESISTANCE; LEAD COMPOUNDS; MICROPROCESSOR CHIPS; SILICON;

ELECTRONICS PACKAGING;

EID: 35348909547     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2007.373774     Document Type: Conference Paper

References (9)

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