Thin-film multichip module packages for high-end IBM servers

IBM Journal of Research and Development

Volumn 42, Issue 5, 1998, Pages 597-605

  Perfecto, E D ^a   Giri, A P ^a   Shields, R R ^a   Longworth, H P ^a   Pennacchia, J R ^a   Jeanneret, M P ^a  

^a NONE

Author keywords

[No Author keywords available]

Indexed keywords

CORROSION; ETCHING; MULTICHIP MODULES; SEMICONDUCTOR DEVICE MANUFACTURE; THIN FILM DEVICES;

MULTILEVEL THIN FILM PACKAGES;

ELECTRONICS PACKAGING;

EID: 0032165234     PISSN: 00188646     EISSN: None     Source Type: Journal    
DOI: 10.1147/rd.425.0597     Document Type: Article

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