A 3D stacked memory integrated on a logic device using SMAFTI technology

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2007, Pages 821-829

  Kurita, Yoichiro ^a   Matsui, Satoshi ^a   Takahashi, Nobuaki ^a   Soejima, Koji ^a   Komuro, Masahiro ^a   Itou, Makoto ^a   Kakegawa, Chika ^a   Kawano, Masaya ^a   Egawa, Yoshimi ^b   Saeki, Yoshihiro ^b   Kikuchi, Hidekazu ^b   Kato, Osamu ^b   Yanagisawa, Azusa ^b   Mitsuhashi, Toshiro ^b   Ishino, Masakazu ^c   Shibata, Kayoko ^c   Uchiyama, Shiro ^c   Yamada, Junji ^c   Ikeda, Hiroaki ^c  

^a RENESAS TECHNOLOGY CORP   (Japan)

^b OKI ELECTRIC INDUSTRY CO   (Japan)

^c Elpida Memory Inc   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

DIES; DYNAMIC RANDOM ACCESS STORAGE; INTERCONNECTION NETWORKS; THREE DIMENSIONAL COMPUTER GRAPHICS;

SMAFTI TECHNOLOGY; STACKED MEMORY;

LOGIC DEVICES;

EID: 35348862384     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2007.373893     Document Type: Conference Paper

References (10)

1. th Micro Electronics Symposium (MES 2005), Osaka, Japan, Oct., 2005, pp. 189-192.
2. th Symposium on "Microjoining and Assembly Technology in Electronics" (Mate 2006), Yokohama, Japan, Feb., 2006, pp. 423-426.
3. th Electric Components and Technology Conference (ECTC 2006), San Diego, CA, May/June, 2006, pp. 289-297.
4. th Micro Electronics Symposium (MES 2006), Osaka, Japan, Oct., 2006, pp. 35-38.
5. th Symposium on "Microjoining and Assembly Technology in Electronics" (Mate 2007), Yokohama, Japan, Feb., 2007, pp. 49-54.
6. M. Kawano, S. Uchiyama, Y. Egawa, N. Takahashi, Y. Kurita, K. Soejima, M. Komuro, S. Matsui, K. Shibata, J. Yamada, M. Ishino, H. Ikeda, Y. Saeki, O. Kato, H. Kikuchi, and T. Mitsuhashi, "A 3D Packaging Technology for 4 Gbit Stacked DRAM with 3 Gbps Data Transfer," International Electron Devices Meeting Technical Digest (IEDM 2006), San Francisco, CA, Dec., 2006, pp. 581-584.
7. T. Matsumoto, Y. Kudoh, M. Tahara, K-H. Yu, N. Miyakawa, H. Itani, T. Ichikizaki, A. Fujiwara, H. Tsukamoto, and M. Koyanagi, Extended Abstracts of the 1995 International Conference on Solid State Devices and Materials (SSDM), 1995, pp.1073-1074.
8. th Electric Components and Technology Conference (ECTC 2004), 2004, pp. 601.
9. P. Morrow, B. Black, M. J. Kobrinsky, S. Muthukumar, D. Nelson, C. M. Park, and C. Webb, "Design and Fabrication of 3D Microprocessors," Proc. of Material Research Society Symposium, 2007.
10. th Electric Components and Technology Conference (ECTC 2005), Orland, FL, May/June, 2005, pp. 89-93.