Ubiquitous relaxation in BTI stressing-new evaluation and insights

IEEE International Reliability Physics Symposium Proceedings

Volumn , Issue , 2008, Pages 20-27

  Kaczer, B ^a   Grasser, T ^b   Roussel, Ph J ^a   Martin Martinez, J ^c   O'Connor, R ^a   O'Sullivan, B J ^a   Groeseneken, G ^d  

^a IMEC   (Belgium)

^b VIENNA UNIVERSITY OF TECHNOLOGY   (Austria)

^c UA Barcelona ^*  (Spain)

^d UNIVERSITY OF LEUVEN   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

NANOSTRUCTURED MATERIALS; THERMODYNAMIC STABILITY;

HIGH-K DIELECTRICS; RELIABILITY PHYSICS; SION DIELECTRIC; STRESS CONDITIONS;

DIELECTRIC MATERIALS;

EID: 51549103535     PISSN: 15417026     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/RELPHY.2008.4558858     Document Type: Conference Paper

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