SCOPUS 정보 검색 플랫폼

Journal of Electronic Materials

Volumn 37, Issue 8, 2008, Pages 1119-1129

Effect of Zn addition on interfacial reactions between Sn-4Ag solder and Ag substrates

(2) Zou, H F a Zhang, Z F a

a INSTITUTE OF METAL RESEARCH (China)

Author keywords

Gravity; Interfaces; Intermetallic compounds; Lead free solder; Sn Ag Zn

Indexed keywords

(I ,J) CONDITIONS; AGING TIME; GROWTH MECHANISMS; INTERFACIAL REACTIONS; INTERMETALLIC COMPOUND (IMC); LIQUID STATE REACTION; LIQUID STATES; ROUGH INTERFACES;

ADDITION REACTIONS; BRAZING; ELECTROCHEMICAL ELECTRODES; FLUIDS; INTERFACES (MATERIALS); INTERMETALLICS; LITHOGRAPHY; METALS; MICROFLUIDICS; PHOTOACOUSTIC EFFECT; SEMICONDUCTING INTERMETALLICS; SOLDERING ALLOYS; SUBSTRATES; TELLURIUM COMPOUNDS; TIN; TIN ALLOYS; WELDING; ZINC;

SILVER;

EID: 46749116340 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-008-0490-8 Document Type: Article

Times cited : (13)

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