Isothermal solid-state aging of Pb-5Sn solder bump on Ni/Cu/Ti under bump metallization

Journal of Alloys and Compounds

Volumn 432, Issue 1-2, 2007, Pages 122-128

  Chen, Chih ming ^a   Wang, Kai jheng ^a   Chen, Ko chieh ^a  

^a NATIONAL CHUNG HSING UNIVERSITY   (Taiwan)

Author keywords

Intermetallics; Microstructure; Solid state reactions

Indexed keywords

AGING OF MATERIALS; INTERMETALLICS; LEAD ALLOYS; METALLIZING; MICROSTRUCTURE; THERMAL EFFECTS;

SOLID-STATE AGING; SOLID-STATE REACTIONS;

SOLDERING ALLOYS;

EID: 33847353007     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2006.05.116     Document Type: Article

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