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Volumn 19, Issue 9, 2004, Pages 2719-2724

Double peritectic behavior of Ag-Zn intermetallics in Sn-Zn-Ag solder alloys

Author keywords

[No Author keywords available]

Indexed keywords

CRYSTALLIZATION; INTERMETALLICS; MICROSTRUCTURE; SCANNING ELECTRON MICROSCOPY; SILVER ALLOYS; SOLDERING ALLOYS; SOLIDIFICATION; X RAY DIFFRACTION ANALYSIS;

EID: 6044274708     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/JMR.2004.0356     Document Type: Article
Times cited : (14)

References (16)
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    • Tu, P.T.1    Chan, Y.C.2    Lai, J.K.L.3
  • 2
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    • Effect of solidstate intermetallic growth on the fracture toughness of Cu/63Sn-37Pb solder joints
    • R.E. Pratt, E.I. Stromswold, and D.J. Quensnel: Effect of solidstate intermetallic growth on the fracture toughness of Cu/63Sn-37Pb solder joints. IEEE Trans. CPMT 19, 134 (1996).
    • (1996) IEEE Trans. CPMT , vol.19 , pp. 134
    • Pratt, R.E.1    Stromswold, E.I.2    Quensnel, D.J.3
  • 5
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    • Microstructure evolution of eutectic Sn-Ag solder joints
    • W. Yang and R.W. Messler, Jr.: Microstructure evolution of eutectic Sn-Ag solder joints. J. Electron. Mater. 23, 765 (1994).
    • (1994) J. Electron. Mater. , vol.23 , pp. 765
    • Yang, W.1    Messler Jr., R.W.2
  • 6
    • 0031192444 scopus 로고    scopus 로고
    • Creep, stress relaxation, and plastic deformation in Sn-Ag and Sn-Zn eutectic solders
    • H. Mavoori, J. Chin, S. Vaynman, B. Moran, L. Keer, and M.E. Fine: Creep, stress relaxation, and plastic deformation in Sn-Ag and Sn-Zn eutectic solders, J. Electron. Mater. 41, 783 (1997).
    • (1997) J. Electron. Mater. , vol.41 , pp. 783
    • Mavoori, H.1    Chin, J.2    Vaynman, S.3    Moran, B.4    Keer, L.5    Fine, M.E.6
  • 7
    • 0037437278 scopus 로고    scopus 로고
    • Microstructure and tensile properties of Sn-9Zn-xAg lead free solder alloys
    • J.M. Song, G.F. Lan, T.S. Lui, and L.H. Chen: Microstructure and tensile properties of Sn-9Zn-xAg lead free solder alloys. Scripta Mater. 48, 1047 (2003).
    • (2003) Scripta Mater. , vol.48 , pp. 1047
    • Song, J.M.1    Lan, G.F.2    Lui, T.S.3    Chen, L.H.4
  • 10
    • 0033221398 scopus 로고    scopus 로고
    • Thermodynamic database for phase diagrams in micro-soldering alloys
    • I. Ohnuma, X.J. Liu, H. Ohtani, and K. Ishida: Thermodynamic database for phase diagrams in micro-soldering alloys. J. Electron. Mater. 28, 1164 (1999).
    • (1999) J. Electron. Mater. , vol.28 , pp. 1164
    • Ohnuma, I.1    Liu, X.J.2    Ohtani, H.3    Ishida, K.4
  • 11
    • 0043199518 scopus 로고    scopus 로고
    • Microstructures and mechanical properties of Sn-8.55Zn-0.45Al-XAg solders
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    • Huang, C.W.1    Lin, K.L.2
  • 12
    • 0141481858 scopus 로고    scopus 로고
    • Behavior of intermetallics in liquid Sn-Zn-Ag solder alloys
    • J.M. Song and K.L. Lin: Behavior of intermetallics in liquid Sn-Zn-Ag solder alloys. J. Mater. Res. 18, 2060 (2003).
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    • Song, J.M.1    Lin, K.L.2
  • 13
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  • 14
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  • 15
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    • Orr, R.L.1    Rovel, J.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.