The mechanical properties of a joint of Sn-3.5Ag-1Zn solder and Cu substrate with aging treatment

Zeitschrift fuer Metallkunde/Materials Research and Advanced Techniques

Volumn 96, Issue 2, 2005, Pages 148-154

  Lee, Doh Jae ^a   Baek, Dae Hwa ^b   Lee, Kyung Ku ^a   Lee, Kwang Min ^a   Seo, Youn Jong ^b  

^a Chonnam National University   (South Korea)

^b Gwangju Jeonnam Reg Small MBA   (South Korea)

Author keywords

Aging treatment; Interfacial reaction; Lead free solder; Shear strength; Tin silver zinc

Indexed keywords

COPPER; CRACK PROPAGATION; SHEAR STRENGTH; SILVER; SOLDERING ALLOYS; STRAIN; SURFACE ROUGHNESS; ZINC;

AGING TREATMENT; INTERFACIAL REACTION; LEAD-FREE SOLDERS; TIN-SILVER-ZINC;

TIN;

EID: 14844299412     PISSN: 00443093     EISSN: None     Source Type: Journal    
DOI: 10.3139/146.101012     Document Type: Article

References (31)

1. M.E. Loomans, S. Vaynman, G. Ghosh, M.E. Fine: J. of Electron. Mater. 23 (1994) 741.
2. J. Glazer: Intern. Mater. Rev. 40 (1995) 65.
3. E.P. Wood, K.L. Nimmo: J. of Electron. Mater. 23 (1994) 709.
4. C.H. Reader, L.E. Felton, V.A. Tanzi, D.B. Knorr: J. of Electron. Mater. 23 (1994) 611.
5. W. Yang, R.W. Merssler, L.E. Felton: J. of Electron. Mater. 23 (1994) 765.
6. L.E. Felton, C.H. Reader, D.B. Knorr: JOM. 2 (1993) 28.
7. M. Harada, R. Satoh: IEEE Transactions on Component, Hybrids and Manufacturing Technology 13 (1990) 736.
8. K. Uenishi, Y. Kohara, S. Sakatani, K.F. Kobayashi, M. Yamamoto: Mater. Trans. 43 (2002) 1833.
9. M.E. Loomans, M.E. Fine: Metall. Mater. Trans. A 31 (2000) 1155.
10. M. Ohnuma, M. Miyashita, K. Anzai, X.J. Liu, H. Ohtani, R. Kainuma, K. Ishida: J. of Electron. Mater. 29 (2000) 1137.
11. W.K. Choi, H.M. Lee: J. of Electron. Mater. 28 (1999) 1251.
12. K.H. Prakash, T. Sritharan: Mater. Sci. and Engin. (2004) 1.
13. D.R. Frear, P.T. Vicano: Metall. and mater. Trans. A-Phys. Metal. and Mater. Sci. 25 (1994) 1509.
14. H.T. Lee, M.H. Chen, H.M. Jao, T.L. Liao: Mater. Sci. and Engin. A 358 (2003) 134.
15. K.S. Kim, S.H. Huh, K. Suganuma: J. of Alloys and Comp. 352 (2003) 226.
16. D.Q. Yu, J. Zhao, L. Wang: J. of Alloy and Comp. 376 (2004) 170.
17. T.C. Chang, M.C. Wang, M.H. Hon: J. of Crystal Growth 263 (2004) 223.
18. A. Hirose, H. Yanagawa, E. Ide, K.F. Kobayashi: Sci. and Techn. of Adv. Mater. 5 (2004) 267.
19. T.C. Chang, M.C. Wang, M.H. Hon: J. of Crystal Growth 252 (2003) 401.
20. S.C. Cheng, K.L. Lin: J. of Electron. Mater. 31 (2002) 940.
21. J. Sigelko, S. Choi, K.N. Subramanian, J.P. Lucas, T.R. Bieler: J. of Electron. Mater. 28 (1999) 1184.
22. W. Yang, R.W. Messler-RW, Jr., L.E. Felton: Welding Research Supplement 74 (1995) 224.
23. W. Yang, L.E. Felton, R.W. Messler-RW, Jr.: J. of Electron. Mater. 24 (1995) 1465.
24. W.J. Tomlinson, A. Fullylove: J. Mater. Sci. 27 (1992) 5777.
25. M.J. Chung, K.K. Lee, D.J. Lee: Korean J. of Mater. Res. 9 (1999) 747.
26. A.J. Kinloch: J. Mater. Sci. 17 (1982) 617.
27. C. Kanchanomai, Y. Miyashita, Y. Mutoh, S.L. Mannan: Mater. Sci. and Engin. A345 (2003) 90.
28. R.J. Fields, S.R. LowIII, G.K. Lucey, Jr.: The metal science of joining (1992) 165.
29. Y. Kariya, M. Otsuka: J. of Electron. Mater. 27 (1998) 1229.
30. M. McCormack, G.W. Kammlott, H.S. Chen, S. Jin: Appl. Phys. Lett. 65 (1994) 1233.
31. S. Ju, B. Sandor, M.E. Plesha: J. of Testing and Evaluation 24 (1996) 411.