Fatigue damage mechanisms of copper single crystal/Sn-Ag-Cu interfaces

Materials Science and Engineering: A

Volumn 435-436, Issue , 2006, Pages 588-594

  Zhu, Q S ^a   Zhang, Z F ^a   Shang, J K ^a,b   Wang, Z G ^a  

^a INSTITUTE OF METAL RESEARCH   (China)

^b University of Illinois at Urbana Champaign   (United States)

Author keywords

Copper single crystal; Cyclic deformation; Fatigue cracking; Interface; Intermetallic compounds (IMCs); Persistent slip bands (PSBs); Sn Ag Cu solder

Indexed keywords

CRACK INITIATION; DEFORMATION; FATIGUE OF MATERIALS; INTERFACES (MATERIALS); INTERMETALLICS; SINGLE CRYSTALS; SOLDERING ALLOYS;

COPPER SINGLE CRYSTAL; CYCLIC DEFORMATION; INTERFACIAL FATIGUE DAMAGE MECHANISMS; PERSISTENT SLIP BANDS;

TIN ALLOYS;

CRACK INITIATION; DEFORMATION; FATIGUE OF MATERIALS; INTERFACES (MATERIALS); INTERMETALLICS; SINGLE CRYSTALS; SOLDERING ALLOYS; TIN ALLOYS;

EID: 33749074067     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2006.07.100     Document Type: Article

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