메뉴 건너뛰기




Volumn 18, Issue 9, 2003, Pages 2060-2067

Behavior of intermetallics in liquid Sn-Zn-Ag solder alloys

Author keywords

[No Author keywords available]

Indexed keywords

COOLING; DIFFERENTIAL SCANNING CALORIMETRY; HEATING; METAL MELTING; MICROSTRUCTURE; MOLTEN MATERIALS; QUENCHING; SILVER; SOLDERING ALLOYS; SOLIDIFICATION; TIN ALLOYS; ZINC;

EID: 0141481858     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/JMR.2003.0290     Document Type: Article
Times cited : (31)

References (14)
  • 4
    • 0003083557 scopus 로고    scopus 로고
    • edited by R.K. Mahidhara, D.R. Frear, S.M.L. Sastry, K.L. Murty, P.K. Liaw, and W.L. Winterbottom (TMS, Warrendale, PA)
    • F. Hau and J. Glazer, Design & Reliability of Solders and Solder Interconnections, edited by R.K. Mahidhara, D.R. Frear, S.M.L. Sastry, K.L. Murty, P.K. Liaw, and W.L. Winterbottom (TMS, Warrendale, PA, 1997), p. 65.
    • (1997) Design & Reliability of Solders and Solder Interconnections , pp. 65
    • Hau, F.1    Glazer, J.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.