Effect of Cu addition on interfacial reactions between Sn-9Zn lead-free solder and Ni substrate

Journal of Materials Research

Volumn 22, Issue 10, 2007, Pages 2663-2667

  Yen, Yee Wen ^a   Liou, Wei Kai ^a  

^a NATIONAL TAIWAN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

DIFFUSION; INTERMETALLICS; NICKEL ALLOYS; SEGREGATION (METALLOGRAPHY); SURFACE CHEMISTRY; TIN ALLOYS; ZINC ALLOYS;

DIFFUSION RATE; INTERMETALLIC COMPOUND EVOLUTION; SEGREGATION RATE;

SOLDERING ALLOYS;

EID: 35449000113     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/jmr.2007.0339     Document Type: Article

References (12)

1. K. Suganuma and K. Niihara: Wetting and interface microstructure between Sn-Zn binary alloys and Cu. J. Mater. Res. 13, 2859 (1998).
2. C.W. Huang and K.L. Lin: Interfacial reactions of lead-free Sn-Zn based solders on Cu and Cu plated electroless Ni-P/Au layer under aging at 150 °C. J. Mater. Res. 19, 3560 (2004).
3. J.M. Song, P.C. Liu, C.L. Shih, and K.L. Lin: Role of Ag in the formation of interfacial intermetallic phases in Sn-Zn soldering. J. Electron. Mater. 34, 1249 (2005).
4. K. Suganuma, T. Murata, H. Noguchi, and Y. Toyoda: Heat resistance of Sn-9Zn solder/Cu interface with or without coating. J. Mater. Res. 15, 884 (2000).
5. K.S. Kim, J.M. Yang, C.H. Yu, I.O. Jung, and H.H. Kim: Analysis on interfacial reactions between Sn-Zn solders and the Au/Ni electrolytic-plated Cu pad. J. Alloy. Compd. 379, 314 (2004).
6. D.Q. Yu, H.P. Xie, and L. Wang: Investigation of interfacial microstructure and wetting property of newly developed Sn-Zn-Cu solders with Cu substrate. J. Alloy. Compd. 385, 119 (2004).
7. C.Y. Chou, S.W. Chen, and Y.S. Chang: Interfacial reactions in the Sn-9Zn-(xCu)/Cu and Sn-9Zn-(xCu)/Ni couples. J. Mater. Res. 21, 1849 (2006).
8. Y.W. Yen, C.C. Jao, and C. Lee: Effect of Cu addition on interfacial reaction between Sn-9Zn solder and Ag J. Mater. Res. 21, 2986 (2006).
9. W.C. Luo, C.E. Ho, J.Y. Tsai, Y.L. Liu, and C.R. Kao: Solid-state reactions between Ni and Sn-Ag-Cu solders with different Cu concentrations. J. Mater. Sci. Eng., A 396, 385 (2005).
10. C.E. Ho, Y.W. Lin, S.C. Yang, C.R. Kao, and D.S. Jinang: Effects of limited Cu supply on soldering reactions between SnAgCu and Ni. J. Electron. Mater. 35, 1017 (2006).
11. H. Okamoto: Binary Phase Diagram (ASM International, Materials Park, OH, 1990).
12. B.F. Dyson, T.R. Anthony, and D. Turnbull: Interstitial diffusion of copper in tin. J. Appl. Phys. 38, 1479 (1967).