Intermetallic compounds formation and interfacial adhesion strength of Sn-9Zn-0.5 Ag solder alloy hot-dipped on Cu substrate

Journal of Alloys and Compounds

Volumn 352, Issue 1-2, 2003, Pages 168-174

  Chang, Tao Chih ^a   Hon, Min Hsiung ^a   Wang, Moo Chin ^b  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

^b NATIONAL KAOHSIUNG UNIVERSITY OF APPLIED SCIENCES   (Taiwan)

Author keywords

Fracture path; Interfacial adhesion strength; Intermetallic compounds; Lead free solder; X ray diffractometer

Indexed keywords

ADHESION; COPPER; ENERGY DISPERSIVE SPECTROSCOPY; INTERFACES (MATERIALS); OPTICAL MICROSCOPY; SCANNING ELECTRON MICROSCOPY; SILVER ALLOYS; SUBSTRATES; TRANSMISSION ELECTRON MICROSCOPY; X RAY DIFFRACTION ANALYSIS;

SOLDER ALLOYS;

INTERMETALLICS;

EID: 0037464018     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0925-8388(02)01122-2     Document Type: Article

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