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Volumn 24, Issue 6, 2006, Pages 2008-2020

Integrated framework for the flux calculation of neutral species inside trenches and holes during plasma etching

Author keywords

[No Author keywords available]

Indexed keywords

CYLINDRICAL SYMMETRY; FLUX CALCULATION; GAS CHOPPING; INTEGRATED FRAMEWORKS; NEUTRAL SPECIES;

EID: 33750935292     PISSN: 07342101     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.2345643     Document Type: Article
Times cited : (37)

References (76)
  • 18
    • 13444255429 scopus 로고    scopus 로고
    • Modeling of film deposition for microelectronic applications, edited by S.Rossnagel and A.Ulman (Academic Press
    • S. Hamaguchi, in Thin Films, Modeling of film deposition for microelectronic applications, edited by, S. Rossnagel, and, A. Ulman, (Academic Press, 1996), Vol. 22, p. 81.
    • (1996) Thin Films , vol.22 , pp. 81
    • Hamaguchi, S.1
  • 19
    • 0003220978 scopus 로고    scopus 로고
    • Modeling of film deposition for microelectronic applications, edited by S.Rossnagel and A.Ulman (Academic Press
    • T. S. Cale and V. Mahadev, in Thin Films, Modeling of film deposition for microelectronic applications, edited by, S. Rossnagel, and, A. Ulman, (Academic Press, 1996), Vol. 22, p. 176.
    • (1996) Thin Films , vol.22 , pp. 176
    • Cale, T.S.1    Mahadev, V.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.