Plasma-etching profile model for SiO2 contact holes

IEEE Transactions on Plasma Science

Volumn 30, Issue 4 II, 2002, Pages 1579-1586

  Liu, Chunli ^a   Abraham Shrauner, Barbara ^a  

^a WASHINGTON UNIVERSITY IN ST LOUIS   (United States)

Author keywords

CF4 CHF3 Ar mixture; Characteristic equations; Deposition; MERIE; Plasma etching; SiO2 contact holes

Indexed keywords

DEPOSITION; PLASMA SIMULATION; REACTIVE ION ETCHING; SCANNING ELECTRON MICROSCOPY; SILICA; SURFACE PHENOMENA;

CONTACT HOLES;

PLASMA ETCHING;

EID: 0037272211     PISSN: 00933813     EISSN: None     Source Type: Journal    
DOI: 10.1109/TPS.2002.804166     Document Type: Article

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