Gap filling with PVD processes for copper metallized integrated circuits

Microelectronic Engineering

Volumn 33, Issue 1-4, 1997, Pages 31-38

  Wenzel, Christian ^a   Urbansky, Norbert ^a   Klimes, Wolfgang ^a   Siemroth, Peter ^b   Schülke, Thomas ^b  

^a DRESDEN UNIVERSITY OF TECHNOLOGY   (Germany)

^b Fraunhofer Inst Mat Phys Surf E   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ASPECT RATIO; COPPER; INTEGRATED CIRCUIT MANUFACTURE; MAGNETRON SPUTTERING; METALLIZING; SUBSTRATES; VAPOR DEPOSITION;

PHYSICAL VAPOR DEPOSITION (PVD);

MICROELECTRONIC PROCESSING;

EID: 0006409998     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/s0167-9317(96)00028-7     Document Type: Article

References (11)

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