Novel metallization technique for filling 100-nm-wide trenches and vias with very high aspect ratio

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 17, Issue 3, 1999, Pages 1094-1097

  Monteiro, Othon R ^a  

^a LAWRENCE BERKELEY NATIONAL LABORATORY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 22644448879     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.590701     Document Type: Article

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