Influence of design geometry and packaging on the response of thermal CMOS flow sensors

International Conference on Solid-State Sensors and Actuators, and Eurosensors IX, Proceedings

Volumn 1, Issue , 1995, Pages 528-531

  Mayer, F ^a   Paul, O ^a   Baltes, H ^a  

^a ETH ZURICH   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

CHARACTERIZATION; CMOS INTEGRATED CIRCUITS; DIELECTRIC MATERIALS; ELECTRONICS PACKAGING; FLOW OF FLUIDS; MICROELECTROMECHANICAL DEVICES; OXIDES; RESISTORS; TEMPERATURE MEASUREMENT;

FLOW CHANNELS; MASKLESS POSTPROCESSING; MICROSENSORS; THERMAL CMOS FLOW SENSORS;

SILICON SENSORS;

EID: 0029531712     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)