Microstructure and kinetic analysis of the properties and behavior of nickel (Ni) nano-particle doped tin-zinc-bismuth (Sn-8Zn-3Bi) solders on immersion silver (Ag)-plated copper (Cu) substrates

Journal of Materials Science: Materials in Electronics

Volumn 25, Issue 6, 2014, Pages 2529-2539

  Fouzder, Tama ^a   Li, Qingqian ^a   Chan, Y C ^a   Chan, Daniel K ^b  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

^b Chartermate Electronics Ltd   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATION ENERGY; BISMUTH; BISMUTH COMPOUNDS; COPPER; COPPER COMPOUNDS; MICROSTRUCTURE; NANOPARTICLES; NEEDLES; NICKEL; REACTION RATES; SILVER; SOLDERING; SOLDERING ALLOYS; SUBSTRATES; ZINC;

COMPOSITE SOLDERS; FINE MICROSTRUCTURE; HETEROGENEOUS NUCLEATION; IMMERSION SILVER; INTERFACIAL MICROSTRUCTURE; INTERMETALLIC COMPOUND LAYER; KINETIC ANALYSIS; SCALLOP-SHAPED;

TIN;

EID: 84901943794     PISSN: 09574522     EISSN: 1573482X     Source Type: Journal    
DOI: 10.1007/s10854-014-1906-2     Document Type: Article

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