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Acta Materialia

Volumn 59, Issue 4, 2011, Pages 1474-1481

Evolution of the microstructure of Sn-Ag-Cu solder joints exposed to ultrasonic waves during solidification

(4) Chinnam, R K a Fauteux, C a Neuenschwander, J a Janczak Rusch, J a

a SWISS FEDERAL LABORATORIES FOR MATERIALS SCIENCE AND TECHNOLOGY (Switzerland)

Author keywords

Cavitation; Intermetallic compounds; Soldering; Solidification microstructure; Ultrasonic waves

Indexed keywords

EVOLUTION OF THE MICROSTRUCTURE; INTERMETALLIC COMPOUNDS; INTERMETALLIC LAYER; MATRIX; REFLOW PROCESS; REFLOW--SOLDERING; SN DENDRITES; SNAGCU SOLDER; SOLDER JOINTS; SOLIDIFICATION MICROSTRUCTURE; SOLIDIFICATION PROCESS; TERNARY EUTECTICS;

CAVITATION; DENDRITES (METALLOGRAPHY); EUTECTICS; FLIP CHIP DEVICES; INTERMETALLICS; LIQUID METALS; MICROSTRUCTURE; NEURONS; SILVER; SILVER ALLOYS; SOLDERING; SOLDERING ALLOYS; SOLIDIFICATION; ULTRASONIC WAVES; ULTRASONICS;

TIN;

EID: 78651383678 PISSN: 13596454 EISSN: None Source Type: Journal
DOI: 10.1016/j.actamat.2010.11.011 Document Type: Article

Times cited : (119)

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