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Volumn 489, Issue 2, 2010, Pages 678-684
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Investigation of small Sn-3.5Ag-0.5Cu additions on the microstructure and properties of Sn-8Zn-3Bi solder on Au/Ni/Cu pads
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Author keywords
Ball grid array solder joints; Microstructure; Multiple reflows; Pb free; Shearing strength
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Indexed keywords
BALL GRID ARRAY SOLDER JOINTS;
CU ADDITION;
INTERMETALLIC COMPOUND LAYER;
INTERMETALLIC COMPOUNDS;
MATRIX;
MICROSTRUCTURE AND PROPERTIES;
PB-FREE;
REFLOW CYCLES;
RICH PHASE;
SCALLOP-SHAPED;
SHEARING STRENGTH;
SN-3.5AG;
SN-8ZN-3BI;
SN-AG-CU;
SN-ZN-BI;
SNAGCU SOLDER;
SOLDER ALLOYS;
SOLDER BALLS;
SOLDER JOINTS;
TOP SURFACE;
WEIGHT PERCENTAGES;
BALL GRID ARRAYS;
BISMUTH COMPOUNDS;
LEAD;
MICROSTRUCTURE;
PHASE INTERFACES;
SEMICONDUCTING INTERMETALLICS;
SHEAR STRENGTH;
SHEARING;
SHEARING MACHINES;
SILVER;
SILVER ALLOYS;
SOLDERING;
SOLDERING ALLOYS;
SPHERES;
TIN ALLOYS;
ZINC;
TIN;
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EID: 70649083150
PISSN: 09258388
EISSN: None
Source Type: Journal
DOI: 10.1016/j.jallcom.2009.09.150 Document Type: Article |
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Times cited : (33)
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References (16)
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