Kinetic analysis of Ni 5Zn 21 growth at the interface between Sn-Zn solders and Ni

Intermetallics

Volumn 22, Issue , 2012, Pages 166-175

  Wang, Chao Hong ^a   Chen, Hsien Hsin ^a   Li, Po Yi ^a   Chu, Po Yen ^a  

^a NATIONAL CHUNG CHENG UNIVERSITY   (Taiwan)

Author keywords

A. Intermetallics, miscellaneous; B. Bonding; B. Phase transformation; C. Joining

Indexed keywords

CHEMICAL TRANSFORMATIONS; CRITICAL THICKNESS; GROWTH BEHAVIOR; GROWTH MECHANISMS; INITIAL STAGES; INTERMETALLICS , MISCELLANEOUS; ISOTHERMAL AGING; KINETIC ANALYSIS; LAYER GROWTH; LINEAR GROWTH; LIQUID STATE; PHASE TRANSFORMATION; REACTION TEMPERATURE; REFLOW--SOLDERING; SN-ZN SOLDER; SOLID-STATE AGING; ZN CONTENT;

ACTIVATION ENERGY; FLIP CHIP DEVICES; INTERMETALLICS; KINETICS; LINEAR TRANSFORMATIONS; MATHEMATICAL TRANSFORMATIONS; SOLDERING ALLOYS; SOLID STATE REACTIONS; ZINC;

TIN;

EID: 84855417338     PISSN: 09669795     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.intermet.2011.11.008     Document Type: Article

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