Effect of micron size Ni particle addition in Sn-8Zn-3Bi lead-free solder alloy on the microstructure, thermal and mechanical properties

Journal of Alloys and Compounds

Volumn 585, Issue , 2014, Pages 32-39

  Billah, Md Muktadir ^a   Shorowordi, Kazi Mohammad ^a   Sharif, Ahmed ^a  

^a BANGLADESH UNIVERSITY OF ENGINEERING AND TECHNOLOGY   (Bangladesh)

Author keywords

Composite solder; Mechanical property; Ni micro particle; Sn Zn Bi solder; Thermal behavior; Zn precipitation

Indexed keywords

COMPOSITE SOLDERS; DIFFERENTIAL THERMAL ANALYZERS; MICRO-PARTICLES; MICROSTRUCTURAL INVESTIGATION; SN-ZN-BI; THERMAL AND MECHANICAL PROPERTIES; THERMAL BEHAVIORS; UNIVERSAL TESTING MACHINES;

ALLOYS; CERIUM ALLOYS; DIFFERENTIAL THERMAL ANALYSIS; MECHANICAL PROPERTIES; NEEDLES; NICKEL; PARTICLE REINFORCED COMPOSITES; SCANNING ELECTRON MICROSCOPY; SOLDERING ALLOYS; TENSILE STRENGTH; TIN ALLOYS; ZINC;

TIN;

EID: 84885339646     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2013.09.131     Document Type: Article

References (35)

1. W.R. Osório, L.C. Peixoto, L.R. Garcia, N.M. Noël, and A. Garcia Microstructure and mechanical properties of Sn-Bi, Sn-Ag and Sn-Zn lead-free solder J. Alloys Compd. 572 2013 97 106
2. C.F. Li, Z.Q. Liu, and J.K. Shang The effects of temperature and humidity growth of tin whisker and hillock from Sn5Nd alloy J. Alloys Compd. 550 2013 231 238
3. C.E. Ho, S.W. Lin, and Y.C. Lin Effects of Pd concentration on the inter reaction and mechanical reliability of the Sn-Pd/Ni system J. Alloys Compd. 509 2011 7749 7757
4. C.H. Lee, W.T. Chen, and C.N. Liao Effect of animony on vigorous interfacial reaction of Sn-Sb/Te couples J. Alloys Compd. 509 2011 5142 5146
5. Y.Y. Shiue, and T.H. Chuang Effect of La addition on the interfacial intermetallics and of Sn-58Bi solder joints with Au/Ni/Cu pads J. Alloys Compd. 491 2010 610 617
6. S. Yagi, T. Ichitsubo, E. Matsubara, M. Yamaguchi, H. Kimura, and K. Sasamori Interfacial reaction of Sn-Zn solder containing Ni and Cu additives J. Alloys Compd. 484 2009 185 189
7. W. Peng An investigation of Sn pest in pure Sn and Sn-based solders Microelectron. Reliab. 49 2009 86 91
8. V. Chidambaram, J. Hald, and J. Hattel Development of gold based solder candidates for flip chip assembly Microelectron. Reliab. 49 2009 323 330
9. M.H. Hon, T.C. Chang, and M.C. Wang Phase transformation and morphology of the intermetallic compounds formed at the Sn-9Zn-3.5Ag/Cu interface in aging J. Alloys Compd. 458 2008 189 199
10. M. Ahmed, T. Fouzder, A. Sharif, A.K. Gain, and Y.C. Chan Influence of Ag micro-particle additions on the microstructure, hardness and tensile properties of Sn-9Zn binary eutectic solder alloy Microelectron. Reliab. 50 2010 1134 1141
11. K.L. Lin, and Y.C. Wang Wetting interaction of Pb-free Sn-Zn-Al solders on metal plated substrate J. Electron. Mater. 27 1998 1205 1210
12. B.I. Noh, J.H. Choi, J.W. Yoon, and S.B. Jung Effects of cerium content on wettability, microstructure and mechanical properties of Sn-Ag-Ce solder alloys J. Alloys Compd. 499 2010 154 159
13. H.T. Lee, H.S. Lin, C.S. Lee, and P.W. Chen Reliability of Sn-Ag-Sb lead-free solder joints Mater. Sci. Eng. A. 407 2005 36 44
14. H.L. Lai, and J.G. Duh Lead-free Sn-Ag and Sn-Ag-Bi solder powders prepared by mechanical alloying J. Electron. Mater. 32 2003 215 220
15. E.E.M. Noor, N.M. Sharif, C.K. Yew, T. Ariga, A.B. Ismail, and Z. Hussain Wettability and strength of In-Bi-Sn lead-free solder alloy on copper substrate J. Alloys Compd. 507 2010 290 296
16. X. Wei, H. Huang, L. Zhou, M. Zhang, and X. Liu On the advantages of using a hypoeutectic Sn-Zn as lead-free solder material Mater. Lett. 61 2007 655 658 (Pubitemid 44855945)
17. M. McCormack, and S. Jin New, lead-free solders J. Electron Mater. 23 1994 635 640
18. I. Shohji, C. Gagg, and W.J. Plumbridge Creep properties of Sn-8Mass%Zn-3Mass%Bi lead free alloy J. Electron. Mater. 33 2004 923 927
19. P.C. Shih, and K.L. Lin Interfacial bonding behavior with introduction of Sn-Zn-Bi paste to Sn-Ag-Cu ball grid array package during multiple reflows J. Mater. Res. 20 2005 219 229
20. A.K. Gain, T. Fouzder, Y.C. Chan, A. Sharif, and W.K.C. Yung Investigation of small Sn-3.5Ag-0.5Cu additions on the microstructure and properties of Sn-8Zn-3Bi solder on Au/Ni/Cu pads J. Alloys Compd. 489 2010 678 684
21. M.A. Haitao, X. Haiping, and L. Wang Effect of a trace of Bi and Ni on the microstructure and wetting properties of Sn-Zn-Cu lead-free solder J. Mater. Sci. Technol. 23 2007 81 84 (Pubitemid 46429579)
22. A.K. Gain, Y.C. Chan, and W.K.C. Yung Effect of nano Ni additions on the structure and properties of Sn-9Zn and Sn-Zn-3Bi solders in Au/Ni/Cu ball grid array packages Mater. Sci. Eng. B. 162 2009 92 98
23. F. Guo Composite lead-free electronic solders J. Mater. Sci.; Mater. Electron. 18 2007 129 145 (Pubitemid 44963681)
24. F. Guo, S. Choi, K.N. Subramanian, T.R. Bieler, J.P. Lucas, A. Achari, and M. Paruchuri Evaluation of creep behavior of near-eutectic Sn-Ag solders containing small amount of alloy additions Mater. Sci. Eng. A: Struct. 351 2003 190 199 (Pubitemid 36463703)
25. F. Guo, J. Lee, and K.N. Subramanian Creep behavior of composite lead-free electronic solder joints Solder. Surf. Mt. Tech. 15 2003 39 42
26. H. Rhee, F. Guo, J.G. Lee, K.C. Chen, and K.N. Subramanian Effects of intermetallic morphology at metallic particle/solder interface on mechanical properties of Sn-Ag based solder joints J. Electron. Mater. 32 2003 1257 1264
27. P. Yao, P. Liu, and J. Liu Effects of multiple reflows on intermetallic morphology and shear strength of SnAgCu-xNi composite solder joints on electrolytic Ni/Au metallized substrate J. Alloys Compd. 462 2008 73 79
28. F. Guo, J. Lee, S. Choi, J.P. Lucas, T.R. Bieler, and K.N. Subramanian Processing and aging characteristics of eutectic Sn-3.5 Ag solder reinforced with mechanically incorporated Ni particles J. Electron. Mater. 30 2001 1073 1082 (Pubitemid 33090669)
29. G. Xu, F. Guo, X. Wang, Z. Xia, Y. Lei, Y. Shi, and X. Li Retarding the electromigration effects to the eutectic SnBi solder joints by micro-sized Ni-particles reinforcement approach J. Alloys Compd. 509 2011 878 884
30. M. Hansen Constitution of Binary Alloys 1958 McGraw-Hill New York
31. Y.S. Kim, K.S. Kim, C.W. Hwang, and K. Suganuma Effect of composition and cooling rate microstructure and tensile properties of Sn-Zn-Bi alloys J. Alloys Compd. 352 2003 237 245
32. Z. Moser, J. Dutkiewicz, W. Gasior, and J. Salawa The Sn-Zn (Tin-Zinc) system Bull. Alloy Phase Diagrams 6 1985 330 334
33. U.R. Kattner Phase diagrams for lead-free solder alloys JOM 54 2002 45 51
34. S.H. Wang, T.S. Chin, C.F. Yang, S.W. Chen, and C.T. Chuang Pb-free solder-alloy based on Sn-Zn-Bi with the addition of germanium J. Alloys Compd. 497 2010 428 431
35. A.A. El-Dalya, Y. Swilema, M.H. Makledb, M.G. El-Shaarawyb, and A.M. Abdrabohb Thermal and mechanical properties of Sn-Zn-Bi lead-free solder alloys J. Alloys Compd. 484 2009 134 142