Enhancing mechanical response of hypoeutectic Sn-6.5Zn solder alloy using Ni and Sb additions

Materials and Design

Volumn 52, Issue , 2013, Pages 966-973

  El Daly, A A ^a   Hammad, A E ^a   Al Ganainy, G A ^b   Ibrahiem, A A ^a  

^a Zagazig University   (Egypt)

^b Ain Shams University   (Egypt)

Author keywords

Creep properties; Lead free solders; Microstructure; Sn Zn alloys

Indexed keywords

ALLOYING; CREEP; CREEP RESISTANCE; EUTECTICS; INTERMETALLICS; MICROSTRUCTURE; NEEDLES; NICKEL; SOLDERED JOINTS; SOLDERING ALLOYS; TIN ALLOYS; ZINC; ZINC ALLOYS;

CREEP PROPERTIES; CREEP STRAIN RATE; ELECTRONIC APPLICATION; ENHANCED SOLID SOLUTIONS; HYPERBOLIC SINE EQUATION; LEAD FREE SOLDERS; MECHANICAL RESPONSE; SN-6.5ZN SOLDERS;

TIN;

EID: 84880363569     PISSN: 02613069     EISSN: 18734197     Source Type: Journal    
DOI: 10.1016/j.matdes.2013.06.023     Document Type: Article

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