Interfacial microstructure and shear behavior of Sn-Ag-Cu solder balls joined with Sn-Zn-Bi paste

Journal of Alloys and Compounds

Volumn 422, Issue 1-2, 2006, Pages 153-163

  Shih, Po Cheng ^a   Lin, Kwang Lung ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

Intermetallics

Indexed keywords

METALLIZING; MICROSTRUCTURE; SHEAR DEFORMATION; SILVER ALLOYS; SOLDERING; SUBSTRATES; THERMOANALYSIS; TIN ALLOYS;

INTERFACIAL BOUNDARY; INTERFACIAL MICROSTRUCTURE; JOINT STRENGTHS; SHEAR STRENGTHS;

INTERMETALLICS;

EID: 33747773377     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2005.11.081     Document Type: Article

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