Investigations of Sn-9Zn-Ag-Ga-Al-Ce solder wetted on Cu, Au/Ni/Cu, and Sn-plated Cu substrates

Welding Journal (Miami, Fla)

Volumn 89, Issue 12, 2010, Pages

  Wang, H ^a   Xue, S ^b   Chen, W ^b   Liu, X ^a   Pan, J ^a  

^a NINGBO UNIVERSITY   (China)

^b NANJING UNIVERSITY OF AERONAUTICS AND ASTRONAUTICS   (China)

Author keywords

Interfacial reaction; Intermetallic compounds; Lead Free solder; Nanoindentation; Sn Zn; Solderability

Indexed keywords

INTERFACIAL REACTIONS; INTERMETALLIC COMPOUNDS; LEAD-FREE SOLDER; SN-ZN; SOLDERABILITY;

ALUMINUM; CERIUM; CERIUM COMPOUNDS; GALLIUM; GALLIUM ALLOYS; HARDNESS; INTERMETALLICS; LEAD COMPOUNDS; MECHANICAL PROPERTIES; NANOINDENTATION; REACTION PRODUCTS; SCANNING ELECTRON MICROSCOPY; SILVER; SOLDERING ALLOYS; SUBSTRATES; WETTING; X RAY DIFFRACTION; X RAY DIFFRACTION ANALYSIS; ZINC;

TIN;

EID: 78651272211     PISSN: 00432296     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (26)

1. Byig, B., Budi D., Hamdi, M., and Ariga, T. 2009. The effects of adding silver and indium to lead-free solders. Welding Journal 88(4): 45-s to 47-s.
2. McCormack, M., and Jin, S. 1993. Progress in the design of new lead-free solder alloys. Journal of the Minerals, Metals and Materials Society 45(7): 36 to 40.
3. Abtew, M., and Selvaduray, G. 2000. Lead-free solders in microelectronics. Materials Science and Engineering R. 27(5-6): 95 to 141.
4. Mavoori, H., Chin, J., Vaynman, S., Moran, B., Keer, L, and Fine, M. 1997. Creep, stress relaxation, and plastic deformation in SnAg and Sn-Zn eutectic solders. Journal of Electron Materials 26(7): 783 to 790.
5. Lin, K. L., and Liu, T. P. 1998. High-temperature oxidation of a Sn-Zn-Al solder. Oxidation of Metals. 50(3-4): 255 to 267.
6. Kim, K. S., Ryu, K. W., Yu, C. H., and Kim, J. K. 2005. The formation and growth of intermetallic compounds and shear strength at Sn-Zn solder/Au-Ni-Cu interfaces. Microelectronics and Reliability 45(3-4): 647 to 655.
7. Date, M., Tu, K. N., Shoji, T., Fujiyosh, M., and Sato, K. 2004. Interfacial reactions and impact reliability of Sn-Zn solder joints on Cu or electroless Au/Ni(P) bond-pads. Journal of Materials Research 19(10): 2887 to 2896.
8. Hirose, A., Yanagawa, H., Ide, E., and Kobayashi, K. F. 2004. Joint strength and interfacial microstructure between Sn-Ag-Cu and Sn-Zn-Bi solders and Cu substrate. Science and Technology of Advanced Materials. 5(1-2): 267 to 276.
9. Wang, H., Xue, S. B., Chen, W. X., and Zhao, F. 2009. Effects of Ga-Ag, Ga-Al, and Al-Ag addition on the wetting characteristics of Sn-9Zn-X-Y lead-free solders. Journal of Materials Science: Materials in Electronics 20(12): 1239 to 1246.
10. Wang, H., Xue, S. B., Chen, W. X., Zhao, F. 2010. Effects of Ga, Al, Ag, and Ce multi-additions on the properties of Sn-9Zn lead-free solder. Journal of Materials Science: Materials in Electronics 21(2): 111 to 119.
11. Manko, H. H. 2001. Solders and Soldering, p. 61, New York, McGraw-Hill, Inc.
12. Mohan, K. K., Shen, L., Zeng K. Y., and Tay, A. A. O. 2006. Nanoindentation study of Zn-based Pb free solders used in fine pitch interconnect applications. Materials Science and Engineering A, 423(1-2): 57 to 63.
13. 3Sn/Cu substrates using wetting balance. Scripta Materials 55(9): 823 to 826.
14. Huang, C. W., and Lin, K. L. 2004. Interfacial reactions of lead-free Sn-Zn based solders on Cu and Cu plated electroless Ni-P/Au layer under aging at 150. Journal of Materials Research 19(12): 3560-s to 3568-s.
15. Yoon, J. W., and Jung, S. B. 2005. Reliability studies of Sn-9Zn/Cu solder joints with aging treatment. Journal of Alloys and Compounds 407(1-2): 141 to 149.
16. Suganuma, K., Niihara, K., Shoutoku, T., and Nakamura, Y. 1998. Wetting and interface microstructure between Sn-Zn binary alloys and Cu. Journal of Materials Research 13(10): 2859 to 2865.
17. Yoon, J. W., and Jung, S. B. 2007. Solder joint reliability evaluation of Sn-Zn/Au/Ni/Cu ball-grid-array package during aging. Materials Science and Engineering A., 452-453: 46 to 54.
18. 4 intermetallic compounds derived by diffusion couples. Materials Science and Engineering A. 485(1-2): 305 to 310.
19. Deng, X., Koopman, M., Chawla, N., and Chawla, K. K. 2004. Young's modulus of (Cu, Ag)-Sn intermetallics measured by nanoindentation. Materials Science and Engineering A. 364(1-2): 240 to 243.
20. Xu, L. H., and Pang John, H. L. 2006. Nanoindentation on SnAgCu lead-free solder joints and analysis. Journal of Electronic Materials 35(12): 2101 to 2115.
21. Lucas, J. P., Rhee, H., Guo, F., and Subramanian, K. N. 2003. Mechanical properties of intermetallic compounds associated with Pbfree solder joints using nanoindentation. Journal of Electron Materials 32(12): 1375 to 1383.
22. Collier, P., Sunappan, V., and Periannan, A. 2002. Lead-free solder process implementation for PCB assembly. Soldering and Surface Mount Technology 14(3): 12 to 18.
23. Tsai, Y. L, and Hwang, W. S. 2005. Solidification behavior of Sn-9Zn-xAg lead-free solder alloys. Materials Science and Engineering A. 413-414: 312 to 316.
24. Song, J. M., Liu, P. C., Shih, C. L., and Lin, K. L. 2005. Role of Ag in the formation of interfacial intermetallic phases in Sn-Zn soldering. Journal of Electronic Materials 34(9): 1249 to 1254.
25. Oliver, W. C., and Pharr, G. M. 1992. An improved technique for determining hardness and elastic modulus using load and displacement sensing indentation experiments. Journal of Materials Research 7(6):1564 to 1583.
26. Meyers, M. A., and Chawla, K. K. 1999. Mechanical Behavior of Materials, p. 112, Prentice-Hall, Upper Saddle River, N.J.