Effect of a trace of bi and Ni on the microstructure and wetting properties of Sn-Zn-Cu lead-free solder

Journal of Materials Science and Technology

Volumn 23, Issue 1, 2007, Pages 81-84

  Ma, Haitao ^a   Xie, Haiping ^a   Wang, Lai ^a  

^a DALIAN UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

Interfacial reaction; Intermetallic compounds; Lead free solder; Microstructure; Wetting property

Indexed keywords

ADDITION REACTIONS; BISMUTH; COPPER ALLOYS; INTERMETALLICS; MELTING POINT; NICKEL; SOLDERING ALLOYS; TIN ALLOYS; WETTING; ZINC ALLOYS;

INTERFACIAL; INTERFACIAL REACTION; INTERMETALLIC COMPOUNDS; LEAD FREE SOLDER; WETTING PROPERTY;

MICROSTRUCTURE;

EID: 33947202214     PISSN: 10050302     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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