Spallation of interfacial Ag-Au-Cu-Zn compounds in Sn-Ag-Cu/Sn-Zn-Bi joints during 210 °C reflow

Journal of Alloys and Compounds

Volumn 439, Issue 1-2, 2007, Pages 137-142

  Shih, Po Cheng ^a   Lin, Kwang Lung ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

Intermetallics

Indexed keywords

BALL GRID ARRAYS; CRACK INITIATION; CRACK PROPAGATION; METALLIZING; SILVER COMPOUNDS; SOLDERING ALLOYS;

AG-AU-CU-ZN COMPOUNDS; MOLTEN SOLDERS; SPALLATION;

INTERMETALLICS;

EID: 34248578517     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2006.08.260     Document Type: Article

References (35)

1. Vuorinen V., Laurila T., Yu H., and Kivilahti J.K. J. Appl. Phys. 99 (2006) 0235301-0235306
2. Alam M.O., Chan Y.C., Tu K.N., and Kivilahti J.K. Chem. Mater. 17 9 (2005) 2223-2226
3. Lee T.Y., Choi W.J., Tu K.N., Jang J.W., Kuo S.M., Lin J.K., Frear D.R., Zeng K., and Kivilahti J.K. J. Mater. Res. 17 2 (2002) 291-301
4. Li D., Liu C., and Conway P.P. J. Electron. Mater. 35 3 (2006) 388-398
5. Ho C.E., Lin Y.W., Yang S.C., Kao C.R., and Jiang D.S. J. Electron. Mater. 35 5 (2006) 1017-1024
6. Laurila T., Vuorinen V., Mattila T., and Kivilahti J.K. J. Electron. Mater. 34 1 (2005) 103-111
7. Lee J., Kim J.H., and Yoo C.D. J. Electron. Mater. 34 1 (2005) 96-102
8. Cook B.A., Anderson I.E., Harringa J.L., and Terpstra R.L. J. Electron. Mater. 31 11 (2002) 1190-1194
9. Ahat S., Sheng M., and Luo L.E. J. Electron. Mater. 30 10 (2001) 1317-1322
10. Rizvi M.J., Chan Y.C., Bailey C., Lu H., and Islam M.N. J. Alloys Compd. 407 (2006) 208-214
11. Chonan Y., Komiyama T., Onuki J., Urao R., Kimura T., and Nagano T. Mater. Trans. 43 8 (2002) 1887-1890
12. Chuang C.M., Shih P.C., and Lin K.L. J. Electron. Mater. 33 1 (2004) 1-6
13. Shih P.C., and Lin K.L. J. Mater. Res. 20 1 (2005) 219-229
14. Berry B.S., and Ames I. IBM J. Res. Dev. 13 (1969) 286-296
15. Kim P.G., Jang J.W., Lee T.Y., and Tu K.N. J. Appl. Phys. 86 12 (1999) 6746-6751
16. Liu A.A., Kim H.K., and Tu K.N. J. Appl. Phys. 80 5 (1996) 2774-2780
17. Pan G.Z., Liu A.A., Kim H.K., and Tu K.N. Appl. Phys. Lett. 71 20 (1997) 2946-2948
18. Kim P.G., Tu K.N., and Abbott D.C. J. Appl. Phys. 84 2 (1998) 770-775
19. Kim P.G., Tu K.N., and Abbott D.C. Appl. Phys. Lett. 71 1 (1997) 61-63
20. Jeon Y.D., Paik K.W., Ostmann A., and Reichl H. J. Electron. Mater. 34 1 (2005) 80-90
21. Zhang F., Li M., Chum C.C., and Shao Z.C. J. Electron. Mater. 32 3 (2003) 123-130
22. Shin C.K., Baik Y.J., and Huh J.Y. J. Electron. Mater. 30 10 (2001) 1323-1331
23. Kim S.W., Yoon J.W., and Jung S.B. J. Electron. Mater. 33 10 (2004) 1182-1189
24. Jang J.W., Frear D.R., Lee T.Y., and Tu K.N. J. Appl. Phys. 88 11 (2000) 6359-6363
25. Li M., Zhang F., Chen W.T., Zeng K., Tu K.N., Balkan H., and Elenius P. J. Mater. Res. 17 7 (2002) 1612-1621
26. Liu C.Y., Kim H.K., Tu K.N., and Totta P.A. Appl. Phys. Lett. 69 26 (1996) 4014-4016
27. Kim H.K., Tu K.N., and Totta P.A. Appl. Phys. Lett. 68 16 (1996) 2204-2206
28. Liu C.Y., Chen C., Mal A.K., and Tu K.N. J. Appl. Phys. 85 7 (1999) 3882-3886
29. Wang S.J., Kao H.J., and Liu C.Y. J. Electron. Mater. 33 10 (2004) 1130-1136
30. P.C. Shih, K.L. Lin, J. Mater. Sci., in press.
31. Massalski T.B. Binary Alloy Phase Diagrams vol. 1 (1986), ASM, Metals Park, OH, USA pp. 85-86
32. Song J.M., Lan G.F., Lui T.S., and Chen L.H. Scripta Mater. 48 (2003) 1047-1051
33. Chang T.C., Hsu Y.T., Hon M.H., and Wang M.C. J. Alloys Compd. 360 (2003) 217-224
34. He M., Lau W.H., Qi G., and Chen Z. Thin Solid Films 462-463 (2004) 376-383
35. Sogo Y., Hojo T., Iwanishi H., Hirose A., Kobayashi K.F., Yamaguchi A., Furusawa A., and Nishida K. Mater. Trans. 45 3 (2004) 734-740