High melting Pb-free solder alloys for die-attach applications

Advanced Engineering Materials

Volumn 7, Issue 10, 2005, Pages 965-969

  Rettenmayr, M ^a,b   Lambracht, P ^a,b   Kempf, B ^c   Graff, M ^c  

^a DARMSTADT UNIVERSITY OF TECHNOLOGY   (Germany)

^b FRIEDRICH SCHILLER UNIVERSITY JENA   (Germany)

^c UMICORE AG AND CO KG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

DIE-ATTACH APPLICATIONS; SOLDER ALLOYS;

BISMUTH ALLOYS; DIES; HIGH TEMPERATURE APPLICATIONS; LEAD; MECHANICAL PROPERTIES;

SOLDERING;

EID: 28444493729     PISSN: 14381656     EISSN: None     Source Type: Journal    
DOI: 10.1002/adem.200500124     Document Type: Review

References (12)

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