Effect of electromigration on mechanical behavior of solder joints

Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces

Volumn 2005, Issue , 2005, Pages 66-69

  Ren, F ^a   Nah, J W ^a   Suh, J O ^a   Tu, K N ^a   Xiong, B S ^b   Xu, L H ^b   Pang, J H L ^b  

^a UNIVERSITY OF CALIFORNIA   (United States)

^b NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

CATHODE INTERFACES; ELECTROMIGRATION EFFECT; MECHANICAL FORCE; TENSILE STRAIN RATE;

CURRENT DENSITY; ELECTROMIGRATION; LEAD; STRAIN RATE; STRESS ANALYSIS; TENSILE TESTING;

SOLDERED JOINTS;

EID: 33746572044     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISAPM.2005.1432048     Document Type: Conference Paper

References (7)

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2. K.Zeng, K.N.Tu, "Six cased of reliability study of Pb-free solder joints in electronic packaging technology", Mat. Sci. and Eng. R38, 2002, pp55-105
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4. K.N.Tu, "Electromigration in stressed this film", Phy. Rev. B, Vol.45, No.3, 1992,pp1409-1413
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6. H.Ohta, N.Nishimura, "Thermal fatique mechanisms of CSP solder joints on PWB", NEC, Res&Develop. Vol.44, No.3, 2003, pp246-250
7. J.H.L.Pang, B.S.Xiong, C.C.Neo, X.R.Zhang, T.H.Low, "Bulk solder and solder joint properties for lead free 95.5Sn-3.8Ag-0.7Cu solder alloy", ECTC conference 2003, pp673-679