Morphology of wetting reactions of SnPb alloys on Cu as a function of alloy composition

Journal of Materials Research

Volumn 13, Issue 1, 1998, Pages 37-43

  Liu, C Y ^a   Tu, K N ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BAND STRUCTURE; COMPOSITION; COPPER; GROWTH (MATERIALS); INTERMETALLICS; MORPHOLOGY; SOLDERING ALLOYS; WETTING;

SIDE BAND GROWTH; TIN LEAD ALLOYS;

TIN ALLOYS;

EID: 0031651011     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/jmr.1998.0006     Document Type: Article

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