Electromigration study of high lead solders in flip-chip packages using the wheatstone bridge method

Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 2004, Pages 968-973

  Ding, Min ^a   Matsuhashi, Hideki ^a   Wang, Guotao ^a   Ho, Paul S ^a   Marathe, Amit ^b   Master, Raj ^b   Pham, Van ^b  

^a UNIVERSITY OF TEXAS AT AUSTIN   (United States)

^b ADVANCED MICRO DEVICES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ATOMIC DIFFUSIVITY; FLIP-CHIP PACKAGES; HIGH LEAD SOLDERS; WHEATSTONE BRIDGE METHODS;

CRACKING (CHEMICAL); CURRENT DENSITY; DATA ACQUISITION; ELECTROMIGRATION; ELECTRONICS PACKAGING; RESISTORS; SOLDERING ALLOYS; VOLTMETERS;

FLIP CHIP DEVICES;

EID: 10444260463     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

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2. International Technology Roadmap for Semiconductors, Semiconductor Industry Association (2000).
3. J.D. Wu, P.J. Zheng, Kelly Lee, C.T. Chiu, and J.J. Lee, "Electromigration Failures of UBM/Bump Systems of Flip-Chip Packages, " Proceedings of the 52th Electronic Components and Technology Conference, San Diego, CA, 2002, pp.
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6. Y.C. Hu, Y.H. Lin et al, "Electromigration Failure in Flip Chip Solder Joints due to Rapid Dissolution of Copper," J. Mater. Res., Vol. 18, No. 11(2003), pp.2544-2548.
7. M. Ding, H. Matsuhashi et al, "Wheatstone bridge method for electromigration study of solder balls in flip-chip packages," International Reliability Physics Symposium Proceedings, Dallas, TX, Mar. 2003, pp. 442-446.
8. H. Ye, C. Basaran, and D. Hopkins, "Thermomigration in Pb-Sn Solder Joints under Joule Heating during Electric Current Stressing," Applied Physics Letters, vol. 82, No. 7(2003), pp. 1045-1047.
9. I. A. Blech and C. Herring, "Electromigration in Thin Aluminum Films on Titanium Nitride," Journal of Applied Physics, vol. 47, No. 4(1976), pp.1203-1208.
10. N. Chen, Z. Yu, "Anomalously Fast Diffusion Mechanism of Solute Atoms in Pb," J. of Mater. Sci. Lett, Vol. 14(1995), pp.557-560.