Use of multicomponent phase diagrams for predicting phase evolution in solder/conductor systems

Journal of Electronic Materials

Volumn 30, Issue 1, 2001, Pages 35-44

  Zeng, K ^a   Kivilahti, J K ^a  

^a AALTO UNIVERSITY   (Finland)

Author keywords

[No Author keywords available]

Indexed keywords

BINARY ALLOYS; INTERMETALLICS; PHASE DIAGRAMS; PHASE EQUILIBRIA; SOLDERED JOINTS; SURFACE CHEMISTRY; THERMAL EFFECTS; THERMODYNAMICS;

INTERFACIAL REACTIONS; MULTICOMPONENT SYSTEMS;

INTERFACES (MATERIALS);

EID: 0035155326     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-001-0212-y     Document Type: Article

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