Condensation and growth of Kirkendall voids in intermetallic compounds

IEEE Transactions on Components and Packaging Technologies

Volumn 32, Issue 3, 2009, Pages 684-692

  Weinberg, Kerstin ^a   Böhme, Thomas ^b  

^a UNIVERSITY OF SIEGEN   (Germany)

^b THYSSENKRUPP STEEL EUROPE AG   (Germany)

Author keywords

Intermetallic compounds; Kirkendall effect; Plastic deformation; Vacancy diffusion; Void distribution; Void growth; Void nucleation

Indexed keywords

INTERMETALLIC COMPOUNDS; KIRKENDALL EFFECT; VACANCY DIFFUSION; VOID DISTRIBUTION; VOID GROWTH; VOID NUCLEATION;

FAILURE ANALYSIS; NUCLEATION; PLASTIC DEFORMATION; PLASTICS; QUALITY ASSURANCE; SAFETY FACTOR; SEMICONDUCTING INTERMETALLICS; SOLDERING ALLOYS; SOLIDS; VACANCIES;

DIFFUSION;

EID: 70349251986     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2008.2010057     Document Type: Article

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