Novel microtensile method for monotonic and cyclic testing of freestanding copper thin films

Proceedings of the Society for Experimental Mechanics, Inc.

Volumn 67, Issue , 2010, Pages 55-64

  Lin, M T ^a   Tong, C J ^a   Shiu, K S ^a  

^a NATIONAL CHUNG HSING UNIVERSITY   (Taiwan)

Author keywords

Cyclic creep of submicron copper thin films; Fatigue testing of Cu thin films; Microtensile testing; Stress strain measurement of copper thin films

Indexed keywords

COPPER FILMS; COPPER THIN FILM; CYCLIC LOADING FREQUENCY; CYCLIC TESTING; ELECTROPLATED NICKEL; FATIGUE TESTS; GAP SENSORS; GRAIN SIZE; MEAN STRESS; MECHANICAL COUPLING; MICRO TENSILE TESTS; MICROTENSILE; MICROTENSILE TESTING; STRESS-STRAIN MEASUREMENT; SUBMICRON; SUPPORTING FRAME; TENSILE LOADS; TENSION-TENSION;

CREEP TESTING; CYCLIC LOADS; DEGREES OF FREEDOM (MECHANICS); EXPERIMENTS; FATIGUE TESTING; MATERIALS TESTING; METALLIC FILMS; NICKEL PLATING; STRAIN RATE; STRESS-STRAIN CURVES; TENSILE TESTING; THIN FILMS;

COPPER;

EID: 79960050362     PISSN: 10466789     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Conference Paper

References (53)

1. Miller SL, Rodgers MS, LaVigne G, Sniegowski JJ, Clews P, Tanner DM, Peterson KA (1998) Failure modes in surface micromachined MicroElectroMechanical actuators. Proceedings of the 36th Annual International Reliability Physics Symposium, pp. 17-25
2. Barbosa N III, El-Deiry P, Vinci RP (2003) Monotonic testing and tension-tension fatigue testing of free-standing Al microtensile beams. Proceedings of the Materials Research Society Symposium on Thin Films - Stresses and Mechanical Properties X, pp. 423-428
3. Vinci RP, Cornella G, Bravman JC (1999) Anelastic Effects in Freestanding Al Thin Films. Proceedings of the 5th International Workshop on Stress Induced Phenomena in Metallization, June, pp. 240-248
4. Lee HJ, Cornella G, Bravman JC (2000) Stress relaxation of free-standing aluminum beams for microelectromechanical systems applications. Appl Phys Lett 7623:3415-3417. doi:10.1063/1.126664
5. Nix WD (1989) Mechanical properties of tin films. Metall Trans A 20A:2217-2245
6. Thompson CV (1993) The yield stress of polycrystalline thin films. J Mater Res 82:237-238. doi:10.1557/JMR.1993.0237
7. Yang Y, Imasogie BI, Allameh SM, Boyce B, Lian K, Lou K, Lou J, Soboyejo WO (2007) Mechanisms of fatigue in LIGA Ni MEMS thin films. Mater Sci Eng A 444:39-50. doi:10.1016/j.msea.2006.06.124 (Pubitemid 44882890)
8. Read DT, Dally JW (1993) Fatigue of microlithographically-patterned free-standing aluminum thin film under axial stresses. J Electron Packag 117:1-6. doi:10.1115/1.2792062
9. Haque MA, Saif MTA (2002) In-situ tensile testing of nano-scale specimens in SEM and TEM. Exp Mech 421:123-128. doi:10.1007/BF02411059 (Pubitemid 34412427)
10. Rajagopalan J, Han JH, Saif MTA (2007) Plastic deformation recovery in freestanding nanocrystalline aluminum and gold thin films. Science 3155820:1831-1834. doi:10.1126/science.1137580 (Pubitemid 46580139)
11. Barbosa N, Keller RR, Read DT, Geiss RH, Vinci RP (2007) Comparison of electrical and microtensile evaluations of mechanical properties of an aluminum film. Metall Mater Trans A 3813:2160-2167. doi: 10.1007/s11661-007-9112-y (Pubitemid 47423112)
12. Lin MT, Tong CJ, Chiang CH (2007) Design and development of sub-micron scale specimens with electroplated structures for the microtensile testing of thin films. Microsyst Technol 1311:1559-1565. doi: 10.1007/s00542-006-0345-2
13. Haque MA, Saif MTA (2002) Application of MEMS force sensors for in situ mechanical characterization of nano-scale thin films in SEM and TEM. Sens Actuators A, Phys 97-98:239-245. doi:10.1016/S0924-4247(01)00861-5
14. Espinosa HD, Zhu Y, Moldovan N (2007) Design and operation of a MEMS-based material testing system for nanomechanical characterization. J Microelectromech Syst 165:1219-1231. doi:10.1109/JMEMS.2007.905739 (Pubitemid 47532914)
15. Read DT (1998) Tension-tension fatigue of copper thin films. Int J Fatigue 203:203-209. doi:10.1016/S0142-1123(97)00080-7
16. Sharpe WN Jr, Yuan B, Edwards RL (1997) New technique for measuring the mechanical properties of thin films. J Microelectromech Syst 63:193-199. doi:10.1109/84.623107
17. Emery RD, Povirk GL (2003) Tensile behavior of free-standing gold films. Part I. Coarse-grained films. Acta Mater 51:2067-2078. doi: 10.1016/S1359- 6454(03)00006-5
18. Emery RD, Povirk GL (2003) Tensile behavior of free-standing gold films. Part 11. Fine-grained films. Acta Mater 51:2079-2087. doi: 10.1016/S1359- 6454(03)00007-7
19. Kraft O, Schwaiger R, Wellner P (2001) Fatigue in thin films: lifetime and damage formation. Mater Sci Eng A 319-321:919-923. doi:10.1016/S0921- 5093(01)00990-X
20. Lin MT, Tong CJ, Shiu KS (2008) Monotonic and fatigue testing of freestanding submicron thin beams application for MEMS. Microsyst Technol 147:1041-1048. doi: 10.1007/s00542-007-0463-5
21. Madou MJ (2002) Fundamentals of microfabrication: the science of miniaturization, 2nd edn. CRC, New York, p 351
22. Harsch S, Ehrfeld W, Maner A (1988) Untersuchungen zur Herstellung von Mikrostructuren grosser Strukturhohe durch Galvanoformung in Nickel-Sulfamatelek-trolyten, KfK, Report No. 4455
23. Truong DV, Hirakata H, Kitamura T (2005) Effect of frequency on fatigue crack growth along interface between copper film and silicon substrate. Proceedings of the International Symposium on 7th Electronics Materials and Packaging, December, pp 61-66
24. Zhang GP, Sun KH, Zhang B, Gong J, Sun C, Wang ZG (2008) Tensile and fatigue strength of ultrathin copper films. Mater Sci Eng A 483-484:387-390. doi:10.1016/j.msea.2007.02.132 (Pubitemid 351494513)
25. Dieter GE (1988) Mechanical metallurgy. McGraw-Hill, New York
26. Mohamed G (2002) The MEMS handbook. CRC, Boca Raton
27. Davis JR (1998) Metals handbook (2nd edn), desk edition. ASM International, Materials Park, p 118
28. Keller RM, Baker SP, Arzt E (1998) Quantitative analysis of strengthening mechanisms in thin Cu films: effects of film thickness, grain size and passivation. J Mater Res 13:1307-1317. doi: 10.1557/JMR.1998.0186
29. Hommel M, Kraft O (2001) Deformation behavior of thin copper films on deformable substrates. Acta Mater 49:3935-3947. doi: 10.1016/S1359-6454(01) 00293-2 (Pubitemid 33018770)
30. Venkatraman R, Bravman JC (1992) Separation of film thickness and grain boundary strengthening effects in Al thin films on Si. J Mater Res 7:2040-2048. doi:10.1557/JMR.1992.2040
31. Keller RM, Baker SP, Arzt E (1999) Stress-temperature behavior of unpassivated thin copper films. Acta Mater 47:415-426. doi:10.1016/S1359- 6454(98)00387-5
32. Doerner MF, Gardner DS, Nix WD (1986) Plastic properties of thin films on substrates as measured by submicron indentation hardness and substrate curvature techniques. J Mater Res 1:845-851. doi: 10.1557/JMR.1986.0845
33. Kuan TS, Murakami M (1982) Low temperature strain behavior of Pb thin films on a substrate. Metall Trans A 13:383-391. doi:10.1007/BF02643347 (Pubitemid 12499182)
34. Espinosa HD, Prorok BC, Peng B (2004) Plasticity size effects in free-standing submicron polycrystalline FCC-films subjected to pure tension. J Mech Phys Solids 52:667-689. doi:10.1016/j.jmps.2003.07.001
35. Jamting K, Bell JM, Swain MV, Schwarzer N (1997) Investigation of the elastic modulus of thin films using simple biaxial bending techniques. Thin Solid Films 308-309:304-309. doi: 10.1016/S0040-6090(97)00559-2
36. Farhat ZN, Ding Y, Northwood DO, Alpas AT (1997) Nanoindentation and friction studies on Ti-based nanolaminated films. Surf Coat Technol 891-2:24-30. doi:10.1016/S0257-8972(96) 02939-8 (Pubitemid 127421406)
37. Sanders PG, Eastman JA, Weertman JR (1997) Elastic and tensile behavior of nanocrystalline copper and palladium. Acta Mater 4510:4019-4025. doi:10.1016/S1359-6454(97)00092-X (Pubitemid 127376782)
38. Legros M, Elliott BR, Rittner MN, Weertman JR, Hemker KJ (2000) Microsample tensile testing of nanocrystalline metals. Philos Mag A 804:1017-1026. doi:10.1080/01418610008212096 (Pubitemid 35401379)
39. Suresh S, Nieh TG, Choi BW (1999) Nano-indentation of copper thin films on silicon substrates. Scripta Materialia 419:951-957. doi: 10.1016/S1359- 6462(99)00245-6 (Pubitemid 30518352)
40. Huang H, Spaepen F (2000) Tensile testing of free-standing Cu, Ag and Al thin films and Ag/Cu multilayers. Acta Mater 4812:3261-3269. doi:10.1016/S1359-6454(00)00128-2
41. Zhao JH, Du Y, Morgen M, Ho PS (2000) Simultaneous measurement of Young's modulus, Poisson ratio, and coefficient of thermal expansion of thin films on substrates. J Appl Phys 873:1575-1578. doi: 10.1063/1.372054
42. Fang TH, Chang WJ (2003) Nanomechanical properties of copper thin films on different substrates using the nanoindentation technique. Microelectron Eng 65:231-238. doi: 10.1016/S01679317(02)00885-7
43. Soifer YM, Verdyan A, Kazakevichb M, Rabkin E (2005) Edge effect during nanoindentation of thin copper films. Mater Lett 5911:1434-1438. doi:10.1016/j.matlet.2004.08.043 (Pubitemid 40308985)
44. Hong SH, Kim KS, Kim YM, Hahn JH, Lee CS, Park JH (2005) Characterization of elastic moduli of Cu thin films using nanoindentation technique. Compos Sci Technol 659:1401-1408. doi:10.1016/j.compscitech.2004.12.010 (Pubitemid 40669277)
45. Khatibi G, Betzwar-Kotas A, Groger V, Weiss B (2005) A study of the mechanical and fatigue properties of metallic microwires. Fatigue Fract Eng Mater Struct 288:723-733. doi: 10.1111/j.1460-2695.2005.00898.x (Pubitemid 41023501)
46. Zhou ZM, Zhou Y, Yang CS, Chen JA, Ding W, Ding GF (2006) The evaluation of Young's modulus and residual stress of copper films by microbridge testing. Sens Actuators A, Phys 1272:392-397. doi:10.1016/j.sna.2005.12.036
47. Wei X, Lee D, Shim S, Chen X, Kysar JW (2007) Plane-strain bulge test for nanocrystalline copper thin films. Scr Mater 576:541-544. doi:10.1016/j. scriptamat.2007.05.012 (Pubitemid 47042553)
48. Schwaiger R, Kraft O (2003) Size effects in the fatigue behavior of thin Ag films. Acta Mater 51:195-206. doi: 10.1016/S1359-6454(02)00391-9
49. Basquin OH (1910) The exponential law of endurance test. Proc ASTM 10:625-630
50. Hong S, Weil R (1996) Low cycle fatigue of thin copper foils. Thin Solid Films 283:175-181. doi: 10.1016/0040-6090(95) 08225-5 (Pubitemid 126388220)
51. Park JH, An JH, Kim YJ, Huh YH, Lee HJ (2008) Tensile and high cycle fatigue test of copper thin film. Mat-wiss u Werkstofftech 392:187-192. doi:10.1002/mawe.200700262
52. Hyun S, Brown WL, Vinci RP (2003) Thickness and temperature dependence of stress relaxation in nanoscale aluminum films. Appl Phys Lett 8321:4411-4413. doi:10.1063/1.1629381
53. Hyun S, Hooghan TK, Brown WL, Vinci RP (2005) Linear viscoelasticity in aluminum thin films. Appl Phys Lett 87061902:1-3 (Pubitemid 41202682)