Tensile and fatigue strength of ultrathin copper films

Materials Science and Engineering: A

Volumn 483-484, Issue 1-2 C, 2008, Pages 387-390

  Zhang, G P ^a   Sun, K H ^a,b   Zhang, B ^b   Gong, J ^a   Sun, C ^a   Wang, Z G ^a  

^a INSTITUTE OF METAL RESEARCH   (China)

^b NORTHEASTERN UNIVERSITY   (China)

Author keywords

Fatigue lifetime; Metal film; Nano sized grain; Size effect; Yield strength

Indexed keywords

COPPER; FATIGUE OF MATERIALS; FILM THICKNESS; STRENGTHENING (METAL); ULTRATHIN FILMS;

MICRO-FORCE TESTING SYSTEM; NANO-SIZED GRAIN;

METALLIC FILMS;

COPPER; FATIGUE OF MATERIALS; FILM THICKNESS; METALLIC FILMS; STRENGTHENING (METAL); ULTRATHIN FILMS;

EID: 41849124232     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2007.02.132     Document Type: Article

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